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PDF 2192VE Data sheet ( Hoja de datos )

Número de pieza 2192VE
Descripción 3.3VIn-SystemProgrammableSuperFASTHighDensityPLD
Fabricantes LatticeSemiconductor 
Logotipo LatticeSemiconductor Logotipo



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No Preview Available ! 2192VE Hoja de datos, Descripción, Manual

ispLSI® 2192VE
3.3V In-System Programmable
SuperFAST™ High Density PLD
Features
• SuperFAST HIGH DENSITY IN-SYSTEM
PROGRAMMABLE LOGIC
— 8000 PLD Gates
— 96 I/O Pins, Nine or Twelve Dedicated Inputs
— 192 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
— Pinout Compatible with ispLSI 2096V and 2096VE
• 3.3V LOW VOLTAGE ARCHITECTURE
— Interfaces with Standard 5V TTL Devices
• HIGH PERFORMANCE E2CMOS® TECHNOLOGY
fmax = 225MHz* Maximum Operating Frequency
tpd = 4.0ns* Propagation Delay
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
• IN-SYSTEM PROGRAMMABLE
— 3.3V In-System Programmability (ISP™) Using
Boundary Scan Test Access Port (TAP)
— Open-Drain Output Option for Flexible Bus Interface
Capability, Allowing Easy Implementation of Wired-
OR Bus Arbitration Logic
— Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE
• THE EASE OF USE AND FAST SYSTEM SPEED OF
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAS
— Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Functional Block Diagram
Output Routing Pool
F7 F6 F5 F4 F3 F2 F1 F0
Output Routing Pool
E7 E6 E5 E4 E3 E2 E1 E0
A0
A1
A2
A3
Global Routing Pool (GRP)
A4
A5
A6
A7
DQ
DQ
Logic
Array D Q GLB
DQ
D7
D6
D5
D4
D3
D2
D1
D0
B0 B1 B2 B3 B4 B5 B6 B7
Output Routing Pool
C0 C1 C2 C3 C4 C5 C6 C7
Output Routing Pool
0139/2192VE
Description
The ispLSI 2192VE is a High Density Programmable
Logic Device containing 192 Registers, nine or twelve
Dedicated Input pins, three Dedicated Clock Input pins,
two dedicated Global OE input pins and a Global Routing
Pool (GRP). The GRP provides complete interconnectivity
between all of these elements. The ispLSI 2192VE
features in-system programmability through the Bound-
ary Scan Test Access Port (TAP) and is 100% IEEE
1149.1 Boundary Scan Testable. The ispLSI 2192VE
offers non-volatile reprogrammability of the logic, as well
as the interconnect to provide truly reconfigurable sys-
tems.
The basic unit of logic on the ispLSI 2192VE device is the
Generic Logic Block (GLB). The GLBs are labeled A0, A1
.. F7 (see Figure 1). There are a total of 48 GLBs in the
ispLSI 2192VE device. Each GLB is made up of four
macrocells. Each GLB has 18 inputs, a programmable
AND/OR/Exclusive OR array, and four outputs which can
be configured to be either combinatorial or registered.
Inputs to the GLB come from the GRP and dedicated
inputs. All of the GLB outputs are brought back into the
GRP so that they can be connected to the inputs of any
GLB on the device.
*Preliminary
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A.
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
August 2000
2192ve_06
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2192VE pdf
Specifications ispLSI 2192VE
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER
TEST 3
COND.
#
DESCRIPTION1
-225
-180
UNITS
MIN. MAX. MIN. MAX.
tpd1
A 1 Data Propagation Delay, 4PT Bypass, ORP Bypass
4.0 5.0 ns
tpd2
A 2 Data Propagation Delay
6.2 7.5 ns
fmax
A 3 Clock Frequency with Internal Feedback 2
225 180 MHz
fmax (Ext.)
fmax (Tog.)
4
Clock
Frequency
with
External
Feedback
(1
tsu2 +
)tco1
5 Clock Frequency, Max. Toggle
150 125
250 200
MHz
MHz
tsu1
6 GLB Reg. Setup Time before Clock, 4 PT Bypass
2.5 3.5 ns
tco1
A 7 GLB Reg. Clock to Output Delay, ORP Bypass
3.2 3.5 ns
th1 8 GLB Reg. Hold Time after Clock, 4 PT Bypass
0.0 0.0 ns
tsu2
9 GLB Reg. Setup Time before Clock
3.5 4.5 ns
tco2
A 10 GLB Reg. Clock to Output Delay
3.7 4.5 ns
th2 11 GLB Reg. Hold Time after Clock
0.0 0.0 ns
tr1 A 12 Ext. Reset Pin to Output Delay
6.0 7.0 ns
trw1
13 Ext. Reset Pulse Duration
3.5 4.0 ns
tptoeen
B 14 Input to Output Enable
6.0 10.0 ns
tptoedis
C 15 Input to Output Disable
6.0 10.0 ns
tgoeen
B 16 Global OE Output Enable
4.5 5.0 ns
tgoedis
C 17 Global OE Output Disable
4.5 5.0 ns
twh 18 External Synchronous Clock Pulse Duration, High
2.0 2.5 ns
twl 19 External Synchronous Clock Pulse Duration, Low
2.0 2.5 ns
1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock.
2. Standard 16-bit counter using GRP feedback.
3. Reference Switching Test Conditions section.
Table 2-0030A/2192VE
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2192VE arduino
Specifications ispLSI 2192VE
Signal Descriptions
Signal Name
RESET
GOE 0, GOE1
Y0, Y1, Y2
BSCAN
TDI/IN 0
TCK/IN 7
TMS/IN 1
TDO/IN 6
IN 2-5, IN 8-11
GND
VCC
NC1
I/O
Description
Active Low (0) Reset pin resets all the registers in the device.
Global Output Enable input pins.
Dedicated Clock Input These clock inputs are connected to one of the clock inputs of all the GLBs in
the device.
Input Dedicated in-system programming Boundary Scan enable input pin. This pin is brought low to
enable the programming mode. The TMS, TDI, TDO and TCK controls become active.
Input This pin performs two functions. When BSCAN is logic low, it functions as a serial data input pin
to load programming data into the device. When BSCAN is high, it functions as a dedicated input pin.
Input This pin performs two functions. When BSCAN is logic low, it functions as a clock pin for the
Boundary Scan state machine. When BSCAN is high, it functions as a dedicated input pin.
Input This pin performs two functions. When BSCAN is logic low, it functions as a mode control pin for
the Boundary Scan state machine. When BSCAN is high, it functions as a dedicated input pin.
Output/Input This pin performs two functions. When BSCAN is logic low, it functions as an output pin
to read serial shift register data. When BSCAN is high, it functions as a dedicated input pin.
Dedicated Input Pins to the device.
Ground (GND)
Vcc
No Connect
Input/Output Pins These are the general purpose I/O pins used by the logic array.
1. NC pins are not to be connected to any active signals, VCC or GND.
Signal Locations
Signal Name
128-Pin TQFP
144-Ball fpBGA
RESET
15
G4
GOE 0, GOE 1
80, 17
F12, G2
Y0, Y1, Y2
14, 83, 78
F3, F10, G11
BSCAN
19
F1
TDI/IN 0
20
G3
TMS/IN 1
48
J6
TDO/IN 6
112
C7
TCK/IN 7
77
G12
IN 2-5, IN 8-11
, 49, 82, , 84, 113, 13, M7, J7, F9, G10, E12, B6,
F2, E1
GND
18, 34, 50, 63, 79, 98, 111,
127
A1, A12, D4, D9, E5, E8, F6,
F7, G6, G7, H5, H8, J4, J9,
M1, M12
VCC
2, 16, 31, 47, 66, 81, 95, 114 B1, B12, E6, E7, F5, F8, G5,
G8, H6, H7, L1, L12
NC1
K2
1. NC pins are not to be connected to any active signals, VCC or GND.
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