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BAS21C 데이터시트 PDF




CYStech Electronics에서 제조한 전자 부품 BAS21C은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 BAS21C 기능
기능 High voltage switching (double) diodes
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BAS21C 데이터시트, 핀배열, 회로
CYStech Electronics Corp.
High voltage switching (double) diodes
BAS21/A/C/SN3
Spec. No. : C335N3
Issued Date : 2009.04.07
Revised Date : 2014.02.24
Page No. : 1/7
Description
High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
Fast switching speed
Low forward voltage drop
Pb-free lead plating and halogen-free package
Mechanical Data
Case : SOT-23, molded plastic
Terminals : Solderable per MIL-STD-202 Method 208
Weight : 0.008 grams(approx.)
Pinning
Pin
BAS21
1A
2 NC
3K
Description
BAS21A
BAS21C
K1 A1
K2 A2
A1,A2
K1,K2
BAS21S
A1
K2
K1,A1
Outline
SOT-23
3
12
(1) BAS21
(2)BAS21A
(3)BAS21C
(4)BAS21S
Diode configuration and symbol
BAS21/A/C/SN3
Marking:
Type
BAS21N3
BAS21AN3
BAS21CN3
BAS21SN3
Marking Code
JS
JS2
JS3
JS4
CYStek Product Specification
http://www.Datasheet4U.com




BAS21C pdf, 반도체, 판매, 대치품
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2009.04.07
Revised Date : 2014.02.24
Page No. : 4/7
Typical Characteristics(Cont.)
Maximum Permissible Non-repetitive Peak Forward Surge Current
10
9
8
7
6
5
4
3
2
1
0
0.001
0.01 0.1
Pulse Duration---tp(ms)
1
10
Recommended Soldering Footprint
BAS21/A/C/SN3
CYStek Product Specification

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BAS21C 전자부품, 판매, 대치품
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C335N3
Issued Date : 2009.04.07
Revised Date : 2014.02.24
Page No. : 7/7
Diagram:
Marking:
XL4X_X
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
BAS21 N3 : Single Diode
(Marking Code JS)
BAS21AN3 : Common Anode. (Marking Code JS2)
BAS21CN3 : Common Cathode. (Marking Code JS3)
BAS21SN3 : Series Connected. (Marking Code JS4)
DIM
Inches
Min. Max.
A 0.1102 0.1204
B 0.0472 0.0669
C 0.0335 0.0512
D 0.0118 0.0197
G 0.0669 0.0910
H 0.0000 0.0040
Millimeters
Min. Max.
2.80 3.04
1.20 1.70
0.89 1.30
0.30 0.50
1.70 2.30
0.00 0.10
DIM
Inches
Min. Max.
J 0.0032 0.0079
K 0.0118 0.0266
L 0.0335 0.0453
S 0.0830 0.1161
V 0.0098 0.0256
L1 0.0118 0.0197
Millimeters
Min. Max.
0.08 0.20
0.30 0.67
0.85 1.15
2.10 2.95
0.25 0.65
0.30 0.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS21/A/C/SN3
CYStek Product Specification

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