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부품번호 | BCP53L3 기능 |
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기능 | General Purpose PNP Epitaxial Planar Transistor | ||
제조업체 | CYStech Electronics | ||
로고 | |||
CYStech Electronics Corp.
General Purpose PNP Epitaxial Planar Transistor
BCP53L3
Spec. No. : C824L3
Issued Date : 2007.03.29
Revised Date : 2010.09.06
Page No. : 1/7
Description
General purpose mainly intended for use in medium power industrial application and for audio amplifier
output stage.
Features
• High collector current and low VCE(SAT)
• Complement to BCP56L3
• Pb-free package
Symbol
BCP53L3
Outline
SOT-223
B:Base
C:Collector
E:Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current(DC)
Collector Current(Pulse)
Power Dissipation @TC=25℃
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
ICP
Pd
Tj
Tstg
BCP53L3
BCE
Limits
-100
-80
-5
-1
-1.5
2
150
-55~+150
Unit
V
V
V
A
A
W
°C
°C
CYStek Product Specification
http://www.Datasheet4U.com
CYStech Electronics Corp.
Typical Characteristics(Cont.)
Power Derating Curve
2.5
2
1.5
1
0.5
0
0 50 100 150
Case Temperature---TC(℃)
200
Spec. No. : C824L3
Issued Date : 2007.03.29
Revised Date : 2010.09.06
Page No. : 4/7
BCP53L3
CYStek Product Specification
4페이지 CYStech Electronics Corp.
SOT-223 Dimension
Spec. No. : C824L3
Issued Date : 2007.03.29
Revised Date : 2010.09.06
Page No. : 7/7
A Marking:
B
1
C
23
Device Code
Date Code
AK
□□
D
E
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
H a1
I
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
CYStek Package Code: L3
DIM
Inches
Min. Max.
A 0.1142 0.1220
B 0.2638 0.2874
C 0.1299 0.1457
D 0.0236 0.0315
E *0.0906
-
F 0.2480 0.2638
Millimeters
Min. Max.
2.90 3.10
6.70 7.30
3.30 3.70
0.60 0.80
*2.30
-
6.30 6.70
DIM
Inches
Min. Max.
G 0.0551 0.0709
H 0.0098 0.0138
I 0.0008 0.0039
a1 *13o
-
a2 0 o
10 o
*: Typical
Millimeters
Min. Max.
1.40 1.80
0.25 0.35
0.02 0.10
*13o
-
0 o 10 o
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BCP53L3
CYStek Product Specification
7페이지 | |||
구 성 | 총 7 페이지수 | ||
다운로드 | [ BCP53L3.PDF 데이터시트 ] |
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부품번호 | 상세설명 및 기능 | 제조사 |
BCP53L3 | General Purpose PNP Epitaxial Planar Transistor | CYStech Electronics |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |