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32LH7000 데이터시트 PDF




LG에서 제조한 전자 부품 32LH7000은 전자 산업 및 응용 분야에서
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부품번호 32LH7000 기능
기능 LCD TV SERVICE MANUAL
제조업체 LG
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32LH7000 데이터시트, 핀배열, 회로
North/Latin America
Europe/Africa
Asia/Oceania
Internal Use Only
http://aic.lgservice.com
http://eic.lgservice.com
http://biz.lgservice.com
LCD TV
SERVICE MANUAL
CHASSIS : LD91D
MODEL : 32LH7000 32LH7000-ZA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
http://www.Datasheet4U.com




32LH7000 pdf, 반도체, 판매, 대치품
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-4-
LGE Internal Use Only

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32LH7000 전자부품, 판매, 대치품
5. Chroma& Brightness
(1) Module optical specification
No. Item Specification
1. Viewing Angle<CR>10>
Right/Left/Up/Down
2. Luminance
Luminance (cd/m2)
Min.
89/89
89/89
400
3. Contrast Ratio
4. CIE Color Coordinates
Variation 1.3
CR
White
RED
Green
Blue
900
Wx Typ
Wy -0.03
Xr
Yr
Xg 0.291
Yg 0.607
Xb 0.145
Yb
Typ.
500
1300
0.279
0.292
0.638
0.334
0.062
Max.
Remark
CR>10
PSM:Vivid,CSM:Cool,
White(100IRE)
Dynamic contrast :off
Dynamic color L off
MAX /MIN
Typ
+0.03
PSM:Vivid,CSM:Cool,
White(85IRE)
Dynamic contrast :off
Dynamic color L off
1) Stable for approximately 60 minutes in a dark environment at 25ºC
2) Operating Ambient Humidity : Min 10, Max 90 %RH
3) Supply Voltage : 24V
4) Frame Frequency : 120Hz
(2) Chroma (PSM: Vivid, Color Temperature: Cool)
- except “RGB PC Mode PSM:Standard,Color Temperature:Medium”
**The W/B Tolerance is ±0.002 for Adjustment, but for DQA ±0.015
No Item
Min
1. Cool White Balance,X axis
0.274
White Balance,Y axis
0.281
2. Medium White Balance,X axis
0.283
White Balance,Y axis
0.291
3. Warm White Balance,X axis
0.311
White Balance,Y axis
0.327
Typ
0.276
0.283
0.285
0.293
0.313
0.329
Max
0.278
0.285
0.287
0.295
0.315
0.331
Remark
DQA :±0.015
DQA :±0.015
DQA :±0.015
DQA :±0.015
DQA :±0.015
DQA :±0.015
(3) SET Optical Feature
1) General feature
No Item
1. 32 inch
Module
LGD
Luminance (min)
C/R(min)
AV,COMPONENT,HDMI AV,COMPONENT,HDMI
400cd/m2
900
Remark
except from the PC mode.
* Measurement Condition: Full white/Dynamic) -> Measure the black luminance after 30 seconds.
2) Special feature (Dynamic CR 15000:1)
No Item
1 Dynamic CR
(Only HDMI mode)
Min
10000
typ
15000
Max
Inch
32”
Power Board P/N
EAY58473201
Remark
HDMI 720p Full Black Pattern
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only

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관련 데이터시트

부품번호상세설명 및 기능제조사
32LH7000

LCD TV SERVICE MANUAL

LG
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32LH7000-ZA

LCD TV SERVICE MANUAL

LG
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