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부품번호 | NHSB046T-N3 기능 |
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기능 | LED | ||
제조업체 | NICHIA CORPORATION | ||
로고 | |||
전체 18 페이지수
NICHIA STS-DA1-1541B <Cat.No.130604>
NICHIA CORPORATION SPECIFICATIONS FOR LED
NHSB046T-N3
● Pb-free Reflow Soldering Application
● Built-in ESD Protection Device
● RoHS Compliant
http://www.Datasheet4U.com
NICHIA STS-DA1-1541B <Cat.No.130604>
Rank N3823
x 0.1834 0. 1874 0. 1932 0. 1893
y 0.2926 0. 3084 0. 3078 0. 2920
Rank N3824
x 0.1874 0. 1913 0. 1971 0.1932
y 0.3084 0. 3242 0. 3235 0.3078
Rank N3825
x 0.1589 0. 1628 0. 1716 0. 1677
y 0.2306 0. 2464 0. 2454 0. 2296
Rank N3826
x 0.1628 0. 1668 0. 1756 0.1716
y 0.2464 0. 2621 0. 2611 0.2454
Rank N3827
x 0.1668 0. 1707 0. 1795 0. 1756
y 0.2621 0. 2779 0. 2769 0. 2611
Rank N3828
x 0.1707 0. 1746 0. 1834 0.1795
y 0.2779 0. 2936 0. 2926 0.2769
Rank N3829
x 0.1746 0. 1786 0. 1874 0. 1834
x
y 0.2936 0. 3094 0. 3084 0. 2926
y
* Ranking at TA=25°C.
* Forward Voltage Tolerance: ±0.05V
* Luminous Intensity Tolerance: ±7%
* Chromaticity Coordinate Tolerance: ±0.005
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
0.1786 0.
0.3094 0.
Rank N3830
1825 0. 1913
3252 0. 3242
0.1874
0.3084
3
4페이지 SOLDERING
NICHIA STS-DA1-1541B <Cat.No.130604>
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
260°CMax
10sec Max
• Recommended Hand Soldering Condition
Temperature
350°C Max
Soldering Time
3sec Max
120sec Max
● Recommended Soldering Pad Pattern
9.2
4
0.8
4
0.8
• Recommended Dip Soldering Condition
Pre-heat
100°C Max
Pre-heat Time
60sec Max
Solder Bath
Temperature
260°C Max
Dipping Time
10sec Max
(単位 Unit: mm)
Blank boxes: Solder resist opening , Shaded areas: Footprint
* This LED is designed to be reflow soldered or dip-soldered on to a PCB.
* Reflow soldering must not be performed more than twice. Dip soldering/hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
6
7페이지 | |||
구 성 | 총 18 페이지수 | ||
다운로드 | [ NHSB046T-N3.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
NHSB046T-N3 | LED | NICHIA CORPORATION |
NHSB046T-N3 | LED | NICHIA CORPORATION |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |