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PDF EMIF02-USB04F3 Data sheet ( Hoja de datos )
| Número de pieza | EMIF02-USB04F3 | |
| Descripción | EMI filter including ESD protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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EMIF02-USB04F3
3-line IPAD™, EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ high efficiency in EMI/ESD protection
■ lead-free package
■ very thin package
■ high reliability offered by monolithic integration
■ high reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4 (on external pins B1 and
C1):
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
■ IEC 61000-4-2 level 1 (on internal pins):
– ±2 kV (air discharge)
– ±2 kV (contact discharge)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ mobile phones and communication systems
■ computers, printers and MCU boards
Description
The EMIF02-USB04F3 chip is a highly integrated
audio filter device designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interference.
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up to 15 kV.
Lead-free Flip-Chip package
(9 bumps)
Figure 1.
Pin configuration (bump side)
3 21
A
B
C
Figure 2.
C1
B1
A1
Configuration
A2 C2 B3
R5 R4 R3
Cline = 20 pF max
R2
C3
R1
A3
B2
October 2010
TM: IPAD is a trademark of STMicroelectronics.
Doc ID 18144 Rev 1
1/7
www.st.com
7
http://www.Datasheet4U.com
1 page  
EMIF02-USB04F3
3 Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
400 µm ± 40
255 µm ± 40
500 µm ± 50
1.14 mm ± 30 µm
170 µm ± 10
Figure 12. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
ECOPAK grade
xxz
y ww
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location
2.0 ± 0.05
4.0 ± 0.1
Ø 1.5 ± 0.1
1.24
0.69 ± 0.05
All dimensions in mm
4.0 ± 0.1
User direction of unreeling
Doc ID 18144 Rev 1
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF02-USB04F3.PDF ] | |
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