|
|
Número de pieza | XP-G | |
Descripción | LEDs | |
Fabricantes | Cree | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de XP-G (archivo pdf) en la parte inferior de esta página. Total 57 Páginas | ||
No Preview Available ! Product family data sheet
Cree® XLamp® XP-G LEDs
Product Description
The XLamp XP-G LED delivers
unprecedented levels of light output
and efficacy for a single die LED.
The XLamp XP-G LED continues
Cree’s history of innovation in
LEDs for lighting applications with
wide viewing angle, symmetrical
package, unlimited floor life and
electrically neutral thermal path.
XLamp XP-G LEDs are the ideal
choice for lighting applications
where high light output and
maximum efficacy are required,
such as LED light bulbs, outdoor
lighting, portable lighting, indoor
lighting and solar-powered lighting.
FEATURES
• Available in white, outdoor white
and 80-CRI, 85-CRI and 90-CRI
white
• ANSI-compatible chromaticity
bins
• Maximum drive current:
1500 mA
• Low thermal resistance: 4 °C/W
• Wide viewing angle: 125°
• Unlimited floor life at
≤ 30 ºC/85% RH
• Reflow solderable - JEDEC
J-STD-020C
• Electrically neutral thermal path
• RoHS- and REACh-compliant
• UL-recognized component
(E349212)
Table of Contents
Flux Characteristics..................... 2
Characteristics........................... 3
Relative Spectral Power
Distribution............................... 3
Relative Flux vs. Junction
Temperature.............................. 4
Electrical Characteristics.............. 4
Thermal Design.......................... 5
Relative Flux vs. Current............. 6
Typical Spatial Distribution........... 6
Relative Chromaticity vs Current
and Temperature........................ 7
Reflow Soldering Characteristics... 8
Notes........................................ 9
Mechanical Dimensions..............10
Tape and Reel...........................11
Packaging.................................12
Copyright © 2009-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without
notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1 page XLamp xp-g leds
Thermal Design
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is
crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to
ambient in order to optimize lamp life and optical characteristics.
1600
1400
1200
1000
800
Rj-a = 10°C/W
600
Rj-a = 15°C/W
Rj-a = 20°C/W
Rj-a = 25°C/W
400
200
0
0 20 40 60 80 100 120
Ambient Temperature (ºC)
140
Copyright © 2009-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
5
5 Page 654321
NOTICE
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
CONTAINED WITHIN ARE THE PROPRIETARY AND
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT
OF CREE INC.
REVISONS
REV
DESCRIPTION
BY DATE APP'D
A Released J.L. 6/30/09
C
Match supplier drawing
DDS 10/21/10 Y.Gan
XLamp xp-g ledsD
Zone A6, 2.15 was 2.1, tolerance was ±
Zone C2, Added pocket dimensions.
.10 . DDS 12/2/10 Y.Gan
E
Zone A6, 2.10 was 2.15
DDS 1/3/11 J.M.
D
F
Zone B5, Added tolerance
to 4.39 and 3.75.
DDS 8/26/11 J.M. D
G ADDED CATHODE AND ANODE NOTE DC 2/27/12
Tape and Reel
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
1.50 +.10/-.00
C
B 4.0±.1
1.75±.10
4.00 ±.10
2.00 ±.10
CATHODE SIDE
8.0±.1
1.5±.1
Cathode Side
1.50 +.10/-00
1.75 ±.10
B
All dimensions in mm.
C
4.39 +.10/.00
3.75 +.10/-.00
12.00 Nominal
12.30 Max
10.25 ±.10
2.5±.1
B 12.0+..30
1.50 +.10/-.00
8.00 ±.10
4.39 +.10/-.00
3.75 +.10/-.00
ANODE SIDE
5.50 ±.10
.30 ± .10
B
8.7°
A
END
2.10 +.10/-.00
Notes:
1. 10 sprocket hole pitch cumulative tolerance ±
65
0.2mm
Anode Side
(denoted by + and circle)
SECTION B-B
THIRD ANGLE PROJECTION
User Feed DirectionUNLESS OTHERWISE SPECIFIED DRAWN BY
DATE
DIMENSIONS ARE IN
D. Seibel
6/30/09
MILLIMETERS AND AFTER FINISH. CHECK
DATE
TOLERANCE UNLESS SPECIFIED:
.XX ± .25
.XXX ± .125
X° ± .5 °
APPROVED
DATE
TITLE
FOR SHEET METAL PARTS ONLY MATERIAL
.X ±
.XX ±
.XXX ±
X° ±
1.5
.75
.25
.5 °
FINAL PROTECTIVE FINISH
SIZE
C
SURFACE FINISH: 1.6
SCALE 4.000
4600 Silicon Drive
Durham, N.C 27703
STARTPhone (919) 313-5300
Fax (919) 313-5558
Carrier Tape, XPE
A
2402-00003DRAWING NO.
SHEET
REV.
G
OF 1 /1
4321
Trailer
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
Loaded Pockets
(1,000 Lamps)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
User Feed Direction
Cover Tape
Pocket Tape
13mm
7"
Copyright © 2009-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered
trademarks of Cree, Inc.
11
11 Page |
Páginas | Total 57 Páginas | |
PDF Descargar | [ Datasheet XP-G.PDF ] |
Número de pieza | Descripción | Fabricantes |
XP-G | LEDs | Cree |
XP-G2 | LEDs | Cree |
XP-M8VM800 | AMD Socket 754 Processor Motherboard | ETC |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |