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PDF APX9136 Data sheet ( Hoja de datos )
| Número de pieza | APX9136 | |
| Descripción | Hall Effect Micro Switch IC | |
| Fabricantes | Anpec Electronics | |
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APX9136
Hall Effect Micro Switch IC
Features
General Description
• Micro Power Operation for Battery Applications The APX9136, integrated circuit, is an ultra-sensitive, pole
• Chopper Stabilized Amplifier
independent Hall-effect switch with a latched digital output.
A 1.6 volt to 3.5 volt operation and an unique clocking
• Independent of North or South Pole Magnet, Easy scheme reduce the average operating power require-
for Manufacture
ments, either a north or a south pole of sufficient flux will
• Small Size Package
• Lead Free and Green Devices Available
turn the output on; in the absence of a magnetic field, the
output is off. The polarity independence and minimal
power requirement allow this device to be easily replaced
(RoHS Compliant)
reed switch for superior for signal conditioning. Advanced
CMOS processing is used to take advantage of low-volt-
age and low-power requirements, VTDFN1.6x1.6-6 pack-
age provides an optimized package for most applications.
Applications
Pin Configuration
• Micro Switch
• Handheld Wireless Application Wake Up Switch
• Clamp Shell Type Application Switch
• Magnet Switch in Low Duty Cycle Applications
NC 1
GND 2
NC 3
6 OUT
5 NC
4 VDD
VTDFN1.6X1.6-6 (Top View)
Thermal Pad
(Connected to GND plane for better dissipation)
Ordering and Marking Information
APX9136
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QF : VTDFN1.6x1.6-6
Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APX9136 QF:
X36
X
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jan., 2011
1
www.anpec.com.tw
1 page  
APX9136
Pin Description
PIN
NO. NAME
1, 3, 5
NC
2 GND
4 VDD
6 VOUT
FUNCTION
No Connection.
Ground Connection.
Power input.
When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than
BOPN), the output turns on (output is low). When the magnetic field is below the release point BRPS (or
above BRPN), the output turns off (output is high).
Block Diagram
VDD
Awake & Sleep
Timing Logic
Hall Plane
Latch
Circuit
Chopper
Amplifier
Hysteresis Control
VOUT
GND
Typical Application Circuit
OUT
VDD
GND
0.1µF
+
1.6V~3.5V
-
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jan., 2011
5
www.anpec.com.tw
5 Page 
APX9136
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time (tP)** within 5°C of the specified
classification temperature (Tc)
3 °C/second max.
183 °C
60-150 seconds
See Classification Temp in table 1
20** seconds
3 °C/second max.
217 °C
60-150 seconds
See Classification Temp in table 2
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
Time 25°C to peak temperature
6 minutes max.
8 minutes max.
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
Volume mm3
<350
<2.5 mm
235 °C
≥2.5 mm
220 °C
Volume mm3
≥350
220 °C
220 °C
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Volume mm3
Thickness
<350
<1.6 mm
260 °C
1.6 mm – 2.5 mm
260 °C
≥2.5 mm
250 °C
Volume mm3
350-2000
260 °C
250 °C
245 °C
Volume mm3
>2000
260 °C
245 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM 2KV
VMM 200V
10ms, 1tr 100mA
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jan., 2011
11
www.anpec.com.tw
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet APX9136.PDF ] | |
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