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PDF PR29MF21NIPF Data sheet ( Hoja de datos )
| Número de pieza | PR29MF21NIPF | |
| Descripción | Zero Cross type DIP 8pin Triac output SSR | |
| Fabricantes | Sharp | |
| Logotipo |  |
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PR29MF21NSZ Series
PR39MF2xNSZ Series
PR29MF21NSZ Series
PR39MF2xNSZ Series
∗Non-zero cross type is also available.
(PR29MF1xNSZ Series/PR39MF1xNSZ Series)
IT(rms)≤0.9A, Zero Cross type
DIP 8pin
Triac output SSR
■ Description
PR29MF21NSZ Series and PR39MF2xNSZ Series
Solid State Relays (SSR) are an integration of an
infrared emitting diode (IRED), a Phototriac Detector
and a main output Triac. These devices are ideally
suited for controlling high voltage AC loads with solid
state reliability while providing 4.0kV isolation
(Viso(rms)) from input to output.
■ Features
1. Output current, IT(rms)≤0.9A
2. Zero crossing functionary (VOX : MAX. 35V)
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage
(VDRM : 600V, PR39MF2xNSZ Series)
(VDRM : 400V, PR29MF21NSZ Series)
5. IFT ranks available (see Model Line-up in this
datasheet)
6. Superior noise immunity (dV/dt : MIN. 100V/µs)
7. Response time, ton : MAX. 50µs
8. Lead-free terminal components are also available
(see Model Line-up section in this datasheet)
9. High isolation voltage between input and output
(Viso(rms) : 4.0kV)
■ Agency approvals/Compliance
1. Recognized by UL508, file No. E94758 (as model No.
R29MF2/R39MF2)
2. Approved by CSA 22.2 No.14, file No. LR63705 (as
model No. R29MF2/R39MF2)
3. Optionary available VDE approved (∗)(DIN EN 60747-5-
2), file No. 40008898 (only for PR39MF2xNSZ Series
as model No. R39MF2)
4. Package resin : UL flammability grade (94V-0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
■ Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Power control in applications such as lighting and
temperature control equipment.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D4-A00701EN
1 Date Mar. 31. 2004
© SHARP Corporation
1 page  
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol Rating Unit
Input
Output
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive
PR29MF21NSZ
peak OFF-state voltage PR39MF2xNSZ
IF
VR
IT(rms)
Isurge
VDRM
50 *3
6
0.9 *3
9 *4
400
600
mA
V
A
A
V
*1Isolation voltage
Viso(rms) 4.0
kV
Operating temperature
Topr −30 to +85 ˚C
Storage temperature
*2Soldering temperature
Tstg −40 to +125 ˚C
Tsol 270 *5 ˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
*5 Lead solder plating models: 260˚C
PR29MF21NSZ Series
PR39MF2xNSZ Series
Soldering area
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Output Holding current
Critical rate of rise of OFF-state voltage
Zero cross voltage
Rank 1
Rank 2
Minimum trigger current
Transfer
charac- Isolation resistance
teristics
Turn-on time
Rank 1
Rank 2
Rank 1
Rank 2
Symbol
VF
IR
IDRM
VT
IH
dV/dt
VOX
IFT
RISO
ton
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=0.9A
VD=V1/D√=−26·VVDRM
IF=15mA, Resistance load
IF=10mA, Resistance load
VD=6V, RL=100Ω
DC500V,40 to 60%RH
IF=20mA, VD=6V, RL=100Ω
IF=10mA, VD=6V, RL=100Ω
MIN.
−
−
−
−
−
100
TYP.
1.2
−
−
−
−
−
(Ta=25˚C)
MAX. Unit
1.4 V
10 µA
100 µA
3.0 V
25 mA
− V/µs
− − 35 V
−
−
10
mA
−−
5
5×1010 1011
−
Ω
− − 50 µs
Sheet No.: D4-A00701EN
5
5 Page 
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300 Terminal : 260˚C peak
( package surface : 250˚C peak)
PR29MF21NSZ Series
PR39MF2xNSZ Series
200
100 Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D4-A00701EN
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet PR29MF21NIPF.PDF ] | |
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