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BD0810J50100AHF PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 BD0810J50100AHF
기능 Ultra Low Profile 0805 Balun 50 ohm to 100 ohm Balanced
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BD0810J50100AHF 데이터시트, 핀배열, 회로
Model BD0810J50100AHF
Rev A
Ultra Low Profile 0805 Balun
50Ω to 100Ω Balanced
Description
The BD0810J50100AHF is a low profile sub-miniature balanced to
unbalanced transformer designed for differential inputs and output locations on next
generation wireless chipsets in an easy to use surface mount package covering the
GSM frequency. The BD0810J50100AHF is ideal for high volume manufacturing
and is higher performance than traditional ceramic and lumped element baluns. The
BD0810J50100AHF has an unbalanced port impedance of 50and a 100
balanced port impedance. This transformation enables single ended signals to be
applied to differential ports on modern semiconductors. The output ports have equal
amplitude (-3dB) with 180 degree phase differential. The BD0810J50100AHF is
available on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications: Specifications subject to change without notice.
ROOM (25°C)
Features:
Parameter
Min. Typ. Max
800 – 1000 MHz
0.7mm Height Profile
50 Ohm to 2 x 50 Ohm
GSM
Low Insertion Loss
Frequency
Unbalanced Port Impedance
Balanced Port Impedance
Return Loss
800 1000
50
100
13 15
Input to Output DC Isolation Insertion Loss*
0.70 0.95
Surface Mountable
Tape & Reel
Non-conductive Surface
RoHS Compliant
Halogen Free
Amplitude Balance
Phase Balance
CMRR
Power Handling
0.2 0.4
12
39
2
Operating Temperature
-55
* Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1 dB higher at +85 ºC)
Outline Drawing
+85
TOP VIEW (Near Side)
2.04±0.10
SIDE VIEW
0.72±0.07
BOTTOM VIEW (Far Side)
4x 0.37
12
3
2x 0.15
Unit
MHz
dB
dB
dB
Degrees
dB
Watts
ºC
1.29±0.10
6x 0.98
6x
0.22
Orientation Marker
Denotes Pin Location
Mechanical Outline
-Dimensions are in Millimeters
-Tolerences are Non-Cumulative
Orientation Marker
Denotes Pin Location
6
4x 0.65
54
Pin Designation
1 In
2 GND/DC Feed
+RF GND
3 Out 1
4 Out 2
5 GND
6 NC
6x
0.30
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www.anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
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BD0810J50100AHF pdf, 반도체, 판매, 대치품
Model BD0810J50100AHF
Rev. A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
No Bias Footprint
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Millimeters
Mounting Footprint
DC Bias Footprint
Circuit Pattern
Footprint Pad (s)
Solder Resist
Plated thru
holes to
ground
Capacitor
Dimensions are in Millimeters
Mounting Footprint
6x .41
6x .33
4x .25
Plated thru holes to ground
3x Transmission
lines
.04
.66
Plated thru
holes to
ground
PART ORIENTATION
TOP DOWN
6x .41
6x .33
4x .25
DC Bias
3x Transmission
lines
.04
.66
Plated thru
holes to
ground
PART ORIENTATION
TOP DOWN
Visit us at
www.anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282

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BD0810J50100AHF

Ultra Low Profile 0805 Balun 50 ohm to 100 ohm Balanced

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