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HCTS85MS 데이터시트 PDF




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부품번호 HCTS85MS 기능
기능 Radiation Hardened 4-Bit Magnitude Comparator
제조업체 Intersil Corporation
로고 Intersil Corporation 로고


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HCTS85MS 데이터시트, 핀배열, 회로
HCTS85MS
September 1995
Radiation Hardened
4-Bit Magnitude Comparator
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/
Bit-Day (Typ)
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Fanout (Over Temperature Range)
-Standard Outputs: 10 LSTTL Loads
• Military Temperature Range: -55oC to +125oC
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
-VIL = 0.8V Max
-VIH = VCC/2 Min
• Input Current Levels Ii 5µA at VOL, VOH
Description
The Intersil HCTS85MS is a Radiation Hardened 4-bit high
speed magnitude comparator. This device compares two
binary, BCD, or other monotonic codes and presents the
three possible magnitude results at the outputs (A>B, A<B,
and A=B). The 4-bit input words are weighted (A0 to A3 and
B0 to B3), where A3 and B3 are the most significant bits.
The HCTS85MS is expandable without external gating, both
serial and parallel operation.
The HCTS85MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family
with TTL input compatibility.
The HCTS85MS is supplied in a 16 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
Pinouts
16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
(SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C
TOP VIEW
B3 1
(A<B)IN 2
(A=B)IN 3
(A>B)IN 4
(A<B)OUT 5
(A=B)OUT 6
(A>B)OUT 7
GND 8
16 VCC
15 A3
14 B2
13 A2
12 A1
11 B1
10 A0
9 B0
16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
(FLATPACK) MIL-STD-1835 CDFP4-F16, LEAD FINISH C
TOP VIEW
B3
(A<B)IN
(A=B)IN
(A>B)IN
(A<B)OUT
(A=B)OUT
(A>B)OUT
GND
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
VCC
A3
B2
A2
A1
B1
A0
B0
Ordering Information
PART NUMBER
HCTS85DMSR
HCTS85KMSR
HCTS85D/Sample
HCTS85K/Sample
HCTS85HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999
1
Spec Number 518624
File Number 3059.1




HCTS85MS pdf, 반도체, 판매, 대치품
Specifications HCTS85MS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
An to (A>B)OUT
SYMBOL
(NOTES 1, 2)
CONDITIONS
TPHL,
TPLH
VCC = 4.5V
Bn to (A>B)OUT
TPHL,
TPLH
VCC = 4.5V
An, Bn to (A<B)OUT
TPHL,
TPLH
VCC = 4.5V
An, Bn to (A=B)OUT
TPHL,
TPLH
VCC = 4.5V
An, Bn to (A>B)OUT
TPHL,
TPLH
VCC = 4.5V
(A>B)IN to
(A>B)OUT
TPHL,
TPLH
VCC = 4.5V
(A=B)IN to
(A=B)OUT
TPHL,
TPLH
VCC = 4.5V
(A<B)IN to
(A<B)OUT
TPHL,
TPLH
VCC = 4.5V
GROUP
A SUB-
GROUPS
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
9
10, 11
TEMPERATURE
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V.
LIMITS
MIN MAX UNITS
2 36 ns
2 43 ns
2 57 ns
2 66 ns
2 45 ns
2 51 ns
2 42 ns
2 50 ns
2 29 ns
2 35 ns
2 34 ns
2 39 ns
2 28 ns
2 37 ns
2 35 ns
2 40 ns
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
Capacitance Power
Dissipation
SYMBOL
CPD
CONDITIONS
VCC = 5.0V, f = 1MHz
Input Capacitance
CIN VCC = 5.0V, f = 1MHz
Output Transition
Time
TTHL,
TTLH
VCC = 4.5V
NOTES
1
1
1
1
1
1
TEMPERATURE
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
+25oC
+125oC, -55oC
MIN MAX UNITS
- 39 pF
- 92 pF
- 10 pF
- 10 pF
- 15 ns
- 22 ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.
Spec Number 518624
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HCTS85MS 전자부품, 판매, 대치품
HCTS85MS
Intersil Space Level Product Flow - ‘MS’
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 24 hrs. min.,
+125oC min., Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% Static Burn-In 2, Condition A or B, 24 hrs. min.,
+125oC min., Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 1, Method 5004 (Notes 1and 2)
100% Dynamic Burn-In, Condition D, 240 hrs., +125oC or
Equivalent, Method 1015
100% Interim Electrical Test 3 (T3)
100% Delta Calculation (T0-T3)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
100% Data Package Generation (Note 5)
NOTES:
1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.
2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number 518624
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부품번호상세설명 및 기능제조사
HCTS85MS

Radiation Hardened 4-Bit Magnitude Comparator

Intersil Corporation
Intersil Corporation

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