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32LH70YR PDF 데이터시트 ( Data , Function )

부품번호 32LH70YR 기능
기능 LCD TV SERVICE MANUAL
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32LH70YR 데이터시트, 핀배열, 회로
North/Latin America
Europe/Africa
Asia/Oceania
Internal Use Only
http://aic.lgservice.com
http://eic.lgservice.com
http://biz.lgservice.com
LCD TV
SERVICE MANUAL
CHASSIS : LP91D
MODEL : 32LH70YR 32LH70YR-LA/TA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.




32LH70YR pdf, 반도체, 판매, 대치품
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-4-
LGE Internal Use Only

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32LH70YR 전자부품, 판매, 대치품
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item
1. Luminance
(W/O PC mode)
2. VIew angle (R/L, U/D)
3. Color Coordinates White
RED
Green
Blue
4. Contrast ratio
5. Luminance Variation
Wx
Wy
Xr
Yr
Xg
Yg
Xb
Yb
Min. Typ. Max. Unit
400 500
cd/m2
Typ
-0.03
900:1
178/ 178
0.279
0.292
0.638
0.334
0.291
0.607
0.145
0.062
1300:1
Typ
+0.03
1.3
degree
Maker
Remark
LGD
CR > 10
LGD 32”(FHD)
LC320WUD-SBA1
(100Hz/Slim)
LGD 32”(100Hz)
6. Component Video Input (Y, PB, PR)
No
Resolution
1 720* 480
2 720* 480
3 720* 576
4 720* 480
5 720* 480
6 720* 576
7 1280* 720
8 1280* 720
9 1280* 720
10 1920* 1080
11 1920* 1080
12 1920* 1080
13 1920* 1080
14 1920* 1080
15 1920* 1080
Specification
H-freq(kHz)
15.73
15.75
15.625
31.47
31.50
31.25
44.96
45.00
37.50
28.125
33.72
33.75
56.25
67.432
67.5
V-freq(Hz)
59.94
60.00
50.00
59.94
60.00
50.00
59.94
60.00
50.00
50.00
59.94
60.00
50
59.94
60.00
Pixel Clock(MHz)
13.500
13.514
13.500
27.000
27.027
27.000
74.176
74.250
74.25
74.250
74.176
74.25
148.5
148.350
148.5
Remark
SDTV, DVD 480I( 525I)
SDTV, DVD 480I( 525I)
SDTV, DVD 576I( 625I) 50Hz
SDTV 480P
SDTV 480P
SDTV 576P 50Hz
HDTV 720P
HDTV 720P
HDTV 720P 50Hz
HDTV 1080I 50Hz,
HDTV 1080I
HDTV 1080I
HDTV 1080P
HDTV 1080P
HDTV 1080P
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-7-
LGE Internal Use Only

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부품번호상세설명 및 기능제조사
32LH70YR

LCD TV SERVICE MANUAL

LG
LG
32LH70YR-LA

LCD TV SERVICE MANUAL

LG
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