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PDF HC125 Data sheet ( Hoja de datos )
| Número de pieza | HC125 | |
| Descripción | Quad 3-State Noninverting Buffers | |
| Fabricantes | Motorola Inc | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HC125 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 3-State
Noninverting Buffers
High–Performance Silicon–Gate CMOS
The MC74HC125A and MC74HC126A are identical in pinout to the LS125
and LS126. The device inputs are compatible with standard CMOS outputs;
with pullup resistors, they are compatible with LSTTL outputs.
The HC125A and HC126A noninverting buffers are designed to be used
with 3–state memory address drivers, clock drivers, and other bus–oriented
systems. The devices have four separate output enables that are active–low
(HC125A) or active–high (HC126A).
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
HC125A
Active–Low Output Enables
HC126A
Active–High Output Enables
A1 2
OE1 1
5
A2
OE2 4
3
Y1
A1
OE1
6
Y2
A2
OE2
2
1
5
4
9
A3
OE3 10
12
A4
13
OE4
8 Y3
A3
11
Y4
OE3
A4
OE4
9
10
12
13
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
HC125A
Inputs Output
A OE Y
HL
LL
XH
H
L
Z
HC126A
Inputs Output
A OE Y
HH
LH
XL
H
L
Z
3 Y1
6
Y2
8 Y3
11
Y4
MC74HC125A
MC74HC126A
N SUFFIX
14–LEAD PLASTIC DIP PACKAGE
CASE 646–06
D SUFFIX
14–LEAD PLASTIC SOIC PACKAGE
CASE 751A–03
DT SUFFIX
14–LEAD PLASTIC TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC74HCXXXAN Plastic
MC74HCXXXAD SOIC
MC74HCXXXADT TSSOP
PIN ASSIGNMENT
OE1 1
A1 2
Y1 3
OE2 4
A2 5
Y2 6
GND 7
14 VCC
13 OE4
12 A4
11 Y4
10 OE3
9 A3
8 Y3
4/97
© Motorola, Inc. 1997
1
REV 8
1 page  
MC74HC125A MC74HC126A
–A–
14
1
G
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
8
–B–
7
P 7 PL
0.25 (0.010) M B M
C R X 45°
F
SEATING
PLANE
D 14 PL
K
0.25 (0.010) M T B S
AS
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0° 7°
0° 7°
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
14
1
A
F
HG
8
B
7
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
C
N
SEATING
PLANE
D
K
L
J
M
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC
2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC
7.62 BSC
M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HC125.PDF ] | |
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