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RDA5851S 데이터시트 PDF




RDA에서 제조한 전자 부품 RDA5851S은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 RDA5851S 기능
기능 Bluetooth Multi-Media Single-Chip Terminal
제조업체 RDA
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RDA5851S 데이터시트, 핀배열, 회로
RDA5851S Datasheet V1.01
RDA5851S Bluetooth Multi-Media Single-Chip Terminal
FEATURES
External Memory Interface
Integrated 8Mbit(or 1MByte) Flash on chip
Power efficient using retention technology to
avoid floating lines
Flexible IO voltage
Power Management
Power On reset control
Internal 32K OSC for standby/ shutoff/ sleep
state
Battery charger (from USB or AC charger)
Integrated all internal voltages from VBAT
Provide all LDOs for external components
User Interface
ADC serial interface Keypad
Connectivity
USB 1.1 Device
UART interface
1 SD controller
I2C controller
I2S controller
General Purpose I/Os
1 GPADC, 10bits, 1 channel
Audio
1 channel voice ADC, 8kHz, 13 bits/sample
for microphone
Voice DAC, 8kHz, 13 bits/sample for
receiver
High fidelity Stereo DAC, up to 48kHz, 16
bits per sample
Stereo analog audio line input
Debug
Host debug interface allowing non intrusive
in depth investigation
GDB debugger
Execution logger and profiling through debug
port
High level text based debugging using Host
debug or USB
FM
Integrated Broadcast FM tuner which can be
tuned world-wide frequency band
Bluetooth
Integrated Bluetooth SoC complaint with 2.1
+ EDR standard
APPLICATIONS
The high level of integration achieved on RDA5851S
allows for highly integrated bluetooth music box and
stereo headset without increasing the BOM.
RDA Microelectronics Inc. CONFIDENTIAL
1 / 72




RDA5851S pdf, 반도체, 판매, 대치품
RDA5851S Datasheet V1.01
B.VI Bluetooth ............................................................................................................................................... 49
General Description ............................................................................................................................. 49
Features ............................................................................................................................................... 50
Block Description ................................................................................................................................. 50
Performance Characteristics ................................................................................................................ 51
C. Memory Map .................................................................................................................................................. 54
D. Pins Description ............................................................................................................................................. 56
D.I Pin-out ..................................................................................................................................................... 56
E. Electrical Characteristics ............................................................................................................................... 60
E.I Absolute Maximum Rating ....................................................................................................................... 60
E.II Temperature Characteristics .................................................................................................................. 60
E.III Audio Characteristics ............................................................................................................................. 60
E.V DC Characteristics ................................................................................................................................. 62
E.VI Digital IO DC Characteristics ................................................................................................................. 67
E.VII Digital IO AC Characteristics (SPI Interface Timing) ............................................................................68
F. Packaging ...................................................................................................................................................... 70
G. Ball Out ......................................................................................................................................................... 71
H. Glossary ........................................................................................................................................................ 72
RDA Microelectronics Inc. CONFIDENTIAL
4 / 72

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RDA5851S 전자부품, 판매, 대치품
RDA5851S Datasheet V1.01
● Memory Bridge
○ internal ROM 20kB for critical constants and code, XCPU boot monitor
○ internal SRAM 64kB for critical data and code. Shared communication memory between the 2
CPUs
○ External Bus Controller (EBC)
16 bit data bus, up to 32MB memory space
● System Modules
○ System CPU (XCPU)
RDA RISC Core
32x32 bits Multiplier Accumulator (MAC)
16/32 bit instruction set
4 kByte Instruction Cache
4 kByte Data Cache
○ DSP Co-Processor (VoC)
Bi-MAC, dual operation unit
16-bit instruction set with 32-bit extension
20 kByte + 20 kByte data RAM on 32 bits
32 kByte instruction RAM on 32 bits
○ Direct Memory Access (DMA)
All size, all alignment and all source and destination possible
32-bit word pattern mode
○ Page Spy
Six memory spaces can be spied
○ System Intelligent Flow Controller (Sys IFC) 7 channels
AHB2APB bridge
Four 8-bit or 32-bit DMA channels to accelerate data transfer between peripherals and
memory
Dedicated specialized channels for DBG Host
○ Audio Interface (AIF)
Tone generator
4 samples In and Out Fifos
I2S / DAI Interface
Serial Input / Output at 8/16 ks/s
Can be used for test purpose in DAI mode
Audio Interface
13 bit RX Data from audio ADC
16 bit TX Data to stereo DAC
○ SPI Flash Controller
Up to size 512Mb x 1, or 256Mb x 1, or 128Mb x 2
● System Peripherals
○ System, PLL and Clock Control (Sys & PLL & Clk Ctrl)
Provides general controls over the whole system, including:
Reset controls
Power management controls
Clock selection
RDA Microelectronics Inc. CONFIDENTIAL
7 / 72

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