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부품번호 | RDA5851S 기능 |
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기능 | Bluetooth Multi-Media Single-Chip Terminal | ||
제조업체 | RDA | ||
로고 | |||
RDA5851S Datasheet V1.01
RDA5851S Bluetooth Multi-Media Single-Chip Terminal
FEATURES
● External Memory Interface
Integrated 8Mbit(or 1MByte) Flash on chip
Power efficient using retention technology to
avoid floating lines
Flexible IO voltage
● Power Management
Power On reset control
Internal 32K OSC for standby/ shutoff/ sleep
state
Battery charger (from USB or AC charger)
Integrated all internal voltages from VBAT
Provide all LDOs for external components
● User Interface
ADC serial interface Keypad
● Connectivity
USB 1.1 Device
UART interface
1 SD controller
I2C controller
I2S controller
General Purpose I/Os
1 GPADC, 10bits, 1 channel
● Audio
1 channel voice ADC, 8kHz, 13 bits/sample
for microphone
Voice DAC, 8kHz, 13 bits/sample for
receiver
High fidelity Stereo DAC, up to 48kHz, 16
bits per sample
Stereo analog audio line input
● Debug
Host debug interface allowing non intrusive
in depth investigation
GDB debugger
Execution logger and profiling through debug
port
High level text based debugging using Host
debug or USB
● FM
Integrated Broadcast FM tuner which can be
tuned world-wide frequency band
● Bluetooth
Integrated Bluetooth SoC complaint with 2.1
+ EDR standard
APPLICATIONS
The high level of integration achieved on RDA5851S
allows for highly integrated bluetooth music box and
stereo headset without increasing the BOM.
RDA Microelectronics Inc. CONFIDENTIAL
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RDA5851S Datasheet V1.01
B.VI Bluetooth ............................................................................................................................................... 49
General Description ............................................................................................................................. 49
Features ............................................................................................................................................... 50
Block Description ................................................................................................................................. 50
Performance Characteristics ................................................................................................................ 51
C. Memory Map .................................................................................................................................................. 54
D. Pins Description ............................................................................................................................................. 56
D.I Pin-out ..................................................................................................................................................... 56
E. Electrical Characteristics ............................................................................................................................... 60
E.I Absolute Maximum Rating ....................................................................................................................... 60
E.II Temperature Characteristics .................................................................................................................. 60
E.III Audio Characteristics ............................................................................................................................. 60
E.V DC Characteristics ................................................................................................................................. 62
E.VI Digital IO DC Characteristics ................................................................................................................. 67
E.VII Digital IO AC Characteristics (SPI Interface Timing) ............................................................................68
F. Packaging ...................................................................................................................................................... 70
G. Ball Out ......................................................................................................................................................... 71
H. Glossary ........................................................................................................................................................ 72
RDA Microelectronics Inc. CONFIDENTIAL
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4페이지 RDA5851S Datasheet V1.01
● Memory Bridge
○ internal ROM 20kB for critical constants and code, XCPU boot monitor
○ internal SRAM 64kB for critical data and code. Shared communication memory between the 2
CPUs
○ External Bus Controller (EBC)
16 bit data bus, up to 32MB memory space
● System Modules
○ System CPU (XCPU)
RDA RISC Core
32x32 bits Multiplier Accumulator (MAC)
16/32 bit instruction set
4 kByte Instruction Cache
4 kByte Data Cache
○ DSP Co-Processor (VoC)
Bi-MAC, dual operation unit
16-bit instruction set with 32-bit extension
20 kByte + 20 kByte data RAM on 32 bits
32 kByte instruction RAM on 32 bits
○ Direct Memory Access (DMA)
All size, all alignment and all source and destination possible
32-bit word pattern mode
○ Page Spy
Six memory spaces can be spied
○ System Intelligent Flow Controller (Sys IFC) 7 channels
AHB2APB bridge
Four 8-bit or 32-bit DMA channels to accelerate data transfer between peripherals and
memory
Dedicated specialized channels for DBG Host
○ Audio Interface (AIF)
Tone generator
4 samples In and Out Fifos
I2S / DAI Interface
Serial Input / Output at 8/16 ks/s
Can be used for test purpose in DAI mode
Audio Interface
13 bit RX Data from audio ADC
16 bit TX Data to stereo DAC
○ SPI Flash Controller
Up to size 512Mb x 1, or 256Mb x 1, or 128Mb x 2
● System Peripherals
○ System, PLL and Clock Control (Sys & PLL & Clk Ctrl)
Provides general controls over the whole system, including:
Reset controls
Power management controls
Clock selection
RDA Microelectronics Inc. CONFIDENTIAL
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7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ RDA5851S.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
RDA5851 | Bluetooth Multi-Media Single-Chip Terminal | RDA |
RDA5851S | Bluetooth Multi-Media Single-Chip Terminal | RDA |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |