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Z0M220-RE-11 데이터시트 PDF




Superworld Electronics에서 제조한 전자 부품 Z0M220-RE-11은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 Z0M220-RE-11 기능
기능 FERRITE CHIP BEADS
제조업체 Superworld Electronics
로고 Superworld Electronics 로고


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Z0M220-RE-11 데이터시트, 핀배열, 회로
FERRITE CHIP BEADS
Z0 SERIES
1. PART NO. EXPRESSION :
Z0K121-RB-10
(a)(b)(c) (d) (e)(f) (g)
(a) Series code
(b) Dimension code
(c) Material code
(d) Impedance code : 470 = 47ȍ
2. CONFIGURATION & DIMENSIONS :
A
D
(e) R : Reel
(f) Current : C = 300mA
(g) : 10 : RoHS Compliant
11 ~ 99 : Internal controlled number
B
Unit:m/m
ABCD
0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05
3. SCHEMATIC :
4. MATERIALS :
ba
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -55°C to +125°C ( include self-temp. rise )
e) Resistance to solder heat : 260°C.10secs
www.DataSheet4U.com
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
11.08.2010
LTD
PG. 1




Z0M220-RE-11 pdf, 반도체, 판매, 대치품
FERRITE CHIP BEADS
Z0 SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
PERFORMANCE
Electrical Characteristics Test
Impedance
DC Resistance
Rated Current
Temperature Rise Test
Refer to standard electrical characteristics list
30°C max. (ǻt)
Solder Heat Resistance
Solderability
Terminal Strength
Appearance : No significant abnormality
Impedance change : Within ±30%
Preheating Dipping Natural
260°C
cooling
150°C
60
seconds
10±0.5
seconds
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping Natural
245°C
cooling
150°C
60
seconds
4±1.0
seconds
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
W
W
TEST CONDITION
HP4291A, HP4287A+16092A
HP4338B
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
For Z Series :
Size Force (Kfg)
1 0.2
2 0.5
3 0.6
4 1.0
5 1.0
6 1.0
7 1.5
8 2.0
Time (sec)
> 25
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
45(1.772) 45(1.772)
Bending
40(1.575)
100(3.937)
www.DataSheet4U.com
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
11.08.2010
LTD
PG. 4

4페이지










Z0M220-RE-11 전자부품, 판매, 대치품
FERRITE CHIP BEADS
Z0 SERIES
9-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit
Recommendable
Figure 4
www.DataSheet4U.com
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
11.08.2010
LTD
PG. 7

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