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PDF BL2012-10B2450 Data sheet ( Hoja de datos )
| Número de pieza | BL2012-10B2450 | |
| Descripción | Multilayer Chip Baluns | |
| Fabricantes | Advanced Ceramic X | |
| Logotipo |  |
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BL 2012 Series
Multilayer Chip Baluns
ACX
Advanced Ceramic X
Features
Monolithic SMD with small, low-profile and
light-weight type.
Applications
0.8 ~ 6 GHz wireless communication systems,
including DECT/PACS/PHS/GSM/DCS phones,
WLAN card, Bluetooth modules, Hyper-LAN, etc.
Specifications
Frequency Unbalanced Balanced Insertion
Part Number Range Impedance Impedance Loss
(MHz)
(ohm)
(ohm)
(dB)
VSWR
@BW
Phase Amplitude
Difference Difference
(degree)
(dB)
BL2012-
10B2450_
2400 ~
2500
50
100 1.0 max. 2.0 max. 180 10 2 max.
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Storage Period
Power Capacity
Part Number
: 4000
: -40 ~ +85 oC
: -40 ~ +85 oC
: 12 months max.
: 2W max.
BL 2012 - 10 B
2450 /LF
Type
BL : Balun
Dimensions ( L × W ) 2.0 × 1.25 mm
Balanced Impedance
Central Frequency
Soldering
10 : 100 ohm
Specification Code
2450 : 2450MHz Packaging
=lead-containing
/LF=lead-free
B
T: Tape & Reel
B: Bulk
Terminal Configuration
No. Terminal Name No.
Unbalanced Port
(IN)
GND or
DC feed + RF GND
Balanced Port
(OUT1)
BL2012-10B2450T/LF REV:2 PAGE:1/7
Terminal Name
Balanced Port
(OUT2)
GND
NC
1 page  
Peel-off Force
Peeling Direction
<100
Top Cover Tape
Carrier Tape
ACX
Advanced Ceramic X
Peel-off force should be in the range of 0.1 – 0.6 N at a peel-off speed of 300±10 mm/min .
Storage Conditions
(1) Temperature: +5 ~35℃, relative humidity (RH): 45~75%.
(2) Non-corrosive environment
Notes
The contents of this data sheet are subject to change without notice. Please confirm the specifications
and delivery conditions when placing your order.
BL2012-10B2450T/LF REV:2 PAGE:5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet BL2012-10B2450.PDF ] | |
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