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CSR1012 데이터시트 PDF




CSR에서 제조한 전자 부품 CSR1012은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 CSR1012 자료 제공

부품번호 CSR1012 기능
기능 Bluetooth Smart IC
제조업체 CSR
로고 CSR 로고


CSR1012 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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CSR1012 데이터시트, 핀배열, 회로
Features
Bluetooth® v4.1 specification compliant
Bluetooth Smart
128KB memory: 64KB RAM and 64KB ROM
Support for Bluetooth v4.1 specification host stack
including ATT, GATT, SMP, L2CAP, GAP
RSSI monitoring for proximity applications
<900nA current consumption in dormant mode
32kHz and 16MHz crystal or system clock
Switch-mode power supply
Programmable general purpose PIO controller
10-bit ADC
12 digital PIOs
3 analogue AIOs
UART
I²C / SPI for EEPROM / flash memory ICs and
peripherals
Debug SPI
4 PWM modules
Wake-up interrupt and watchdog timer
QFN 32-lead, 4 x 4 x 0.65mm, 0.4mm pitch
General Description
CSR1012 QFN is a CSR µEnergy platform device.
CSR µEnergy are CSR's single-mode Bluetooth low
energy products for the Bluetooth Smart market.
CSR1012 QFN is a small footprint variant of CSR1010
QFN.
CSR μEnergy enables ultra low-power connectivity and
basic data transfer for applications previously limited by
the power consumption, size constraints and complexity
of other wireless standards. CSR1012 QFN provides
everything required to create a Bluetooth low energy
product with RF, baseband, MCU, qualified Bluetooth
v4.1 specification stack and customer application
running on a single IC.
16MHz
32kHz
Bluetooth LE
Radio and Modem
MCU
ROM
RAM
Clock
Generation
I/O
UART
LED PWM
PIO
AIO
Debug
I2C / SPI
CSR µEnergy® CSR1012 QFN
Bluetooth Smart IC
Production Information
CSR1012A05
Issue 5
Applications
Building an ecosystem using Bluetooth low energy
CSR is the industry leader for Bluetooth low energy, also
known as Bluetooth Smart. Bluetooth Smart enables
connectivity and data transfer to leading smartphone,
tablet and personal computing devices including Apple
iPhone, iPad, iPod and Mac products and leading
Android devices.
Bluetooth low energy takes less time to make a
connection than conventional Bluetooth wireless
technology and can consume approximately 1/20th of
the power of Bluetooth Basic Rate. CSR1012 QFN
supports profiles for health and fitness sensors,
watches, keyboards, mice and remote controls.
Typical Bluetooth Smart applications:
HID: keyboards, mice, touchpads, remote controls
Sports and fitness sensors: heart rate, runner
speed and cadence, cycle speed and cadence
Health sensors: blood pressure, thermometer and
glucose meters
Mobile accessories: watches, proximity tags, alert
tags and camera controls
Smart home: heating control and lighting control
Production Information
© Cambridge Silicon Radio Limited 2013-2015
Page 1 of 48
CS-238833-DSP5
www.csr.com




CSR1012 pdf, 반도체, 판매, 대치품
Functional Block Diagram
Wake-up
I2C EEPROM
SPI Serial Flash
AES-CCS and
AES Encryption
I2C / SPI Serial Flash
I2C / SPI
Serial
Flash
DMA
Control State Machine
ROM
RF
Bluetooth Radio
Bluetooth LE Modem
and LC
RAM Arbiter
RAM 64KB
Memory
Protection
Code
Data
MCU
Interrupt
Debug
Timer
XTAL_16M XTAL_32K
Clock Generation
I/O
UART
PIO and LED
PWM
AUX / CLK /
PSU Control
PIO
VDD_PADS
LDO
SMPU
Production Information
© Cambridge Silicon Radio Limited 2013-2015
Debug
VDDREG_IN VDD_BAT
Page 4 of 48
CS-238833-DSP5
www.csr.com

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CSR1012 전자부품, 판매, 대치품
Contents
Ordering Information ........................................................................................................................................... 2
Contacts ..................................................................................................................................................... 2
Device Details ..................................................................................................................................................... 3
Functional Block Diagram .................................................................................................................................. 4
1 Package Information ......................................................................................................................................... 10
1.1 Pinout Diagram ........................................................................................................................................ 10
1.2 Device Terminal Functions ....................................................................................................................... 11
1.3 Package Dimensions ............................................................................................................................... 14
1.4 PCB Design and Assembly Considerations ............................................................................................. 15
1.5 Typical Solder Reflow Profile ................................................................................................................... 15
2 Bluetooth Modem .............................................................................................................................................. 16
2.1 RF Ports ................................................................................................................................................... 16
2.2 RF Receiver ............................................................................................................................................. 16
2.2.1 Low Noise Amplifier .................................................................................................................... 16
2.2.2 RSSI Analogue to Digital Converter ........................................................................................... 16
2.3 RF Transmitter ......................................................................................................................................... 16
2.3.1 IQ Modulator ............................................................................................................................... 16
2.3.2 Power Amplifier .......................................................................................................................... 16
2.4 Bluetooth Radio Synthesiser .................................................................................................................... 16
2.5 Baseband ................................................................................................................................................. 16
2.5.1 Physical Layer Hardware Engine ............................................................................................... 16
3 Clock Generation ............................................................................................................................................... 17
3.1 Clock Architecture .................................................................................................................................... 17
3.2 Crystal Oscillator: XTAL_16M_IN and XTAL_16M_OUT .......................................................................... 17
3.2.1 Crystal Specification ................................................................................................................... 17
3.2.2 Frequency Trim .......................................................................................................................... 18
3.3 Sleep Clock .............................................................................................................................................. 18
3.3.1 Crystal Specification ................................................................................................................... 18
4 Operating Modes ............................................................................................................................................... 20
4.1 Run Mode ................................................................................................................................................. 20
4.2 Idle Mode ................................................................................................................................................. 20
4.3 Deep Sleep Mode .................................................................................................................................... 20
4.4 Hibernate Mode ........................................................................................................................................ 20
4.5 Dormant Mode ......................................................................................................................................... 20
5 Microcontroller, Memory and Baseband Logic .................................................................................................. 21
5.1 System RAM ............................................................................................................................................ 21
5.2 Internal ROM ........................................................................................................................................... 21
5.3 Microcontroller .......................................................................................................................................... 21
5.4 Programmable I/O Ports, PIO and AIO .................................................................................................... 21
5.5 LED Flasher / PWM Module ..................................................................................................................... 22
5.6 Temperature Sensor ................................................................................................................................ 23
5.7 Battery Monitor ......................................................................................................................................... 24
6 Serial Interfaces ................................................................................................................................................ 25
6.1 Application Interface ................................................................................................................................. 25
6.1.1 UART Interface ........................................................................................................................... 25
6.2 I²C Interface ............................................................................................................................................. 25
6.3 SPI Master Interface ................................................................................................................................ 27
6.4 Programming and Debug Interface .......................................................................................................... 29
6.4.1 Instruction Cycle ......................................................................................................................... 29
Production Information
© Cambridge Silicon Radio Limited 2013-2015
Page 7 of 48
CS-238833-DSP5
www.csr.com

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