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NB3L553 데이터시트 PDF




ON Semiconductor에서 제조한 전자 부품 NB3L553은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 NB3L553 자료 제공

부품번호 NB3L553 기능
기능 2.5V / 3.3V / 5.0V 1:4 Clock Fanout Buffer
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NB3L553 데이터시트, 핀배열, 회로
NB3L553
2.5 V / 3.3 V / 5.0 V
1:4 Clock Fanout Buffer
Description
The NB3L553 is a low skew 1−to 4 clock fanout buffer, designed for
clock distribution in mind. The NB3L553 specifically guarantees low
output−to−output skew. Optimal design, layout and processing
minimize skew within a device and from device to device.
The output enable (OE) pin tri−states the outputs when low.
Features
Input/Output Clock Frequency up to 200 MHz
Low Skew Outputs (35 ps)
Output Enable Mode Three−States Outputs
Operating Range: VDD = 2.375 V to 5.25 V
Ideal for Networking Clocks
Packaged in 8−pin SOIC
Industrial Temperature Range
These are Pb−Free Devices
http://onsemi.com
8
1
SOIC−8
D SUFFIX
CASE 751
MARKING DIAGRAMS*
8
3L553
ALYW
G
1
3N553 = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
Q1
Q2
CLK
Q3
Q4
OE
Figure 1. Block Diagram
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 0
1
DFN8
MN SUFFIX
CASE 506AA
14
XX = Specific Device Code
M = Date Code
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
PINOUT
VDD
Q0
Q1
GND
1
2
3
4
8
OE
7
Q3
6
Q2
5
ICLK
ORDERING INFORMATION
Device
Package
Shipping
NB3L553DG
NB3L553DR2G
SOIC−8
(Pb−Free)
SOIC−8
(Pb−Free)
98 Units/Rail
2500/Tape & Reel
NB3L553MNR4G* DFN−8 1000/Tape & Reel
(Pb−Free)
*Contact Sales Representative
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1 Publication Order Number:
NB3L553/D




NB3L553 pdf, 반도체, 판매, 대치품
NB3L553
AC CHARACTERISTICS; VDD = 2.5 V +5% (VDD = 2.375 V to 2.625 V, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Symbol
Characteristic
Min Typ Max
Unit
fin Input Frequency
− − 200
tr/tf Output rise and fall times; 0.8 V to 2.0 V
− 1.0 1.5
tpd Propagation Delay, CLK to Qn (Note 4)
2.2 3.0 5.0
tskew
Output−to−output skew; (Note 5)
− 35 −
tskew
Device−to−device skew, (Note 5)
− − 500
AC CHARACTERISTICS; VDD = 3.3 V +5% (VDD = 3.15 V to 3.45 V, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Symbol
Characteristic
Min Typ Max
MHz
ns
ns
ps
ps
Unit
fin Input Frequency
− − 200
tr/tf Output rise and fall times; 0.8 V to 2.0 V
− 0.6 1.0
tpd Propagation Delay, CLK to Qn (Note 4)
2.0 2.4 4.0
tskew
Output−to−output skew; (Note 5)
− 35 50
tskew
Device−to−device skew, (Note 5)
− − 500
AC CHARACTERISTICS; VDD = 5.0 V +5% (VDD = 4.75 V to 5.25 V, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Symbol
Characteristic
Min Typ Max
MHz
ns
ns
ps
ps
Unit
fin Input Frequency
− − 200 MHz
tr/tf Output rise and fall times; 0.8 V to 2.0 V
− 0.3 0.7 ns
tpd Propagation Delay, CLK to Qn (Note 4)
1.8 2.5 4.0 ns
tskew
Output−to−output skew; (Note 5)
− 35 − ps
tskew
Device−to−device skew, (Note 5)
− − 500 ps
3. Outputs loaded with external RL = 33−W series resistor and CL = 15 pF to GND for proper operation. Duty cycle out = duty in. A 0.01 mF
decoupling capacitor should be connected between VDD and GND.
4. Measured with rail−to−rail input clock
5. Measured on rising edges at VDD ÷ 2 between any two outputs with equal loading.
http://onsemi.com
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부품번호상세설명 및 기능제조사
NB3L553

2.5V / 3.3V / 5.0V 1:4 Clock Fanout Buffer

ON Semiconductor
ON Semiconductor

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