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PDF SP5001 Data sheet ( Hoja de datos )
| Número de pieza | SP5001 | |
| Descripción | 4 Channel Common Mode Filter | |
| Fabricantes | Littelfuse | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SP5001 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP5001 Series
SP5001 Series 4ChannelCommonModeFilterwithESDProtection
RoHS Pb GREEN
Description
The SP5001 Series is a highly integrated Common Mode
Filter (CMF) providing both ESD protection and EMI
common mode noise filtering for systems using high
speed differential serial interfaces, such as MIPI D-PHY or
HDMI.
The SP5001 Series can protect and filter two differential
line pairs in a small RoHS-compliant TDFN-10 package, with
cost and space savings over discrete solutions.
Pinout
In 1+ 1
In 1- 2
GND 3
In 2+ 4
In 2- 5
10 Out 1+
9 Out 1-
8 GND
7 Out 2+
6 Out 2-
Note :This drawing is not to scale.
Functional Block Diagram
Pin1
External Pin2
(Connector)
Pin4
Pin5
Pin10
Pin9
Internal
(ASIC)
Pin7
Pin6
Pin3 Pin8
Features
• Large differential
bandwidth > 2.5 GHz
• High Common Mode
Stop Band Attenuation:
> 25 dB at 700 MHz
> 30 dB at 800 MHz
• ±15kV ESD protection
per channel (IEC 61000-
4-2 Level 4, contact
discharge)
• TDFN-10 2.50mm ×
2.00mm × 0.75mm
package with 0.50mm
lead pitch
• RoHS-compliant, Lead-
free packaging
• AEC-Q101 qualified
Applications
• HDMI/DVI Display in
Mobile Phones
• MIPI D-PHY (CSI-2, DSI,
etc) in Mobile Phones and
Digital Still Cameras
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
1 page  
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP5001 Series
Package Dimensions —TDFN-10
2 X 0.10 C
D
AB
PIN 1
MARKING
2 X 0.10 C
TOP VIEW
DETAIL B
0.05 C
0.05 C
SIDE VIEW
A3
A
A1 C
DETAIL A
1
5
L
L1
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
MOLD CMPD
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
A1
TDFN-10
JEDEC MO-229
Millimeters
Inches
Min Max Min Max
A 0.70 0.80 0.028 0.031
A1 0.00 0.05 0.000 0.002
A3
0.2 REF
0.008 REF
b 0.15 0.25 0.006 0.010
D
2.50 BSC
0.098 BSC
E
2.00 BSC
0.079 BSC
e
0.50 BSC
0.020 BSC
L 0.70 0.90 0.028 0.035
L1 0.05 0.15 0.002 0.006
8X
1.07
8X
0.30
PACK AGE
OUTLINE
0.10 8X L
MIN
1
10 6
e 9X b
0.45
0.50 PITCH
BOTTOM VIEW
0.10 M C A B
0.05 M C
Recommended
Soldering
Footprint
Tape & Reel Specification –TDFN-10
P0 P2
T
Top
Cover
Tape
5° Max
W
A0
B0
K0 P
扑1.50 +0.10
E
Device Orientation in Tape
F
1.00 ±0.05
Pin1 Location
Symbol
E
F
P
P0
P2
W
A0
B0
K0
T
Dimensions
Millimetres
1.75+/- 0.10
3.5 +/- 0.05
4.0 +/- 0.10
4.0 +/- 0.10
2.0 +/- 0.05
8.00 +0.30/- 0.10
2.19 +/- 0.05
2.77 +/- 0.05
1.05 +/- 0.05
0.25+/- 0.02
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/08/14
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet SP5001.PDF ] | |
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