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Número de pieza | MPXV10 | |
Descripción | 10 kPa Uncompensated Silicon Pressure Sensors | |
Fabricantes | Motorola Semiconductors | |
Logotipo | ||
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No Preview Available ! MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPX10/D
10 kPa
Uncompensated
Silicon Pressure Sensors
The MPX10 and MPXL10 series devices are silicon piezoresistive pressure sensors
providing a very accurate and linear voltage output — directly proportional to the applied
pressure. These standard, low cost, uncompensated sensors permit manufacturers to
design and add their own external temperature compensation and signal conditioning
networks. Compensation techniques are simplified because of the predictability of
Motorola’s single element strain gauge design.
Features
• Low Cost
• Patented Silicon Shear Stress Strain Gauge Design
• Ratiometric to Supply Voltage
• Easy to Use Chip Carrier Package Options
• Differential and Gauge Options
SMALL OUTLINE PACKAGE
MPXV10
Application Examples
• Air Movement Control
• Environmental Control Systems
• Level Indicators
• Leak Detection
• Medical Instrumentation
• Industrial Controls
• Pneumatic Control Systems
• Robotics
MPXV10GC6U
CASE 482A–01
MPXV10GC7U
CASE 482C–03
Figure 1 shows a schematic of the internal
circuitry on the stand–alone pressure sensor chip.
PIN NUMBER
3 + VS
SENSING
ELEMENT
1 GND
2
+ Vout
4
– Vout
1 Gnd 5 N/C
2 +Vout 6 N/C
3 Vs 7 N/C
4 –Vout 8 N/C
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground.
MPX10
MPXV10
SERIES
0 to 10 kPa (0 – 1.45 psi)
35 mV FULL SCALE SPAN
(TYPICAL)
UNIBODY PACKAGES
MPX10
BASIC CHIP
CARRIER ELEMENT
CASE 344–15, STYLE 1
DIFFERENTIAL
PORT OPTION
CASE 344C–01, STYLE 1
NOTE: Pin 1 is the notched pin.
PIN NUMBER
1 Gnd 3 VS
2 +Vout 4 –Vout
Figure 1. Uncompensated Pressure
Sensor Schematic
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor increases with increasing pressure
applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage
increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure
side (P1).
REV 9
© MMotootroolrao, lIanc.S2e0n00sor Device Data
1
1 page UNIBODY PACKAGE DIMENSIONS
MPX10 MPXV10 SERIES
C
B
J
R
M
–A–
PIN 1
1234
N
L
–T–
SEATING
PLANE
F
D 4 PL
G
0.136 (0.005) M T A M
1 2 34
Z
F
Y
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. “F” 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
DIM MIN MAX
A 0.595 0.630
B 0.514 0.534
C 0.200 0.220
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
L 0.695 0.725
M 30_ NOM
N 0.475 0.495
R 0.430 0.450
Y 0.048 0.052
Z 0.106 0.118
MILLIMETERS
MIN MAX
15.11 16.00
13.06 13.56
5.08 5.59
0.41 0.51
1.22 1.63
2.54 BSC
0.36 0.40
17.65 18.42
30_ NOM
12.07 12.57
10.92 11.43
1.22 1.32
2.68 3.00
CASE 344–15
ISSUE Z
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
BASIC ELEMENT (D)
SEATING
PLANE
–T–
R
J
C
–A–
U
H
L
N PORT #1
POSITIVE
PRESSURE
(P1)
B
PIN 1
–P–
0.25 (0.010) M T Q S
12 34
F
G
D 4 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: INCH.
–Q–
K
S
INCHES
DIM MIN MAX
A 1.145 1.175
B 0.685 0.715
C 0.305 0.325
D 0.016 0.020
F 0.048 0.064
G 0.100 BSC
H 0.182 0.194
J 0.014 0.016
K 0.695 0.725
L 0.290 0.300
N 0.420 0.440
P 0.153 0.159
Q 0.153 0.159
R 0.230 0.250
S 0.220 0.240
U 0.910 BSC
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
7.75 8.26
0.41 0.51
1.22 1.63
2.54 BSC
4.62 4.93
0.36 0.41
17.65 18.42
7.37 7.62
10.67 11.18
3.89 4.04
3.89 4.04
5.84 6.35
5.59 6.10
23.11 BSC
0.13 (0.005) M T S S Q S
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. – OUTPUT
CASE 344B–01
ISSUE B
PRESSURE SIDE PORTED (GP)
Motorola Sensor Device Data
5
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet MPXV10.PDF ] |
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