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PDF TSL238 Data sheet ( Hoja de datos )
| Número de pieza | TSL238 | |
| Descripción | HIGH-SENSITIVITY LIGHT-TO-FREQUENCY CONVERTER | |
| Fabricantes | TAOS | |
| Logotipo |  |
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D High-Resolution Conversion of Light
Intensity to Frequency With No External
Components
D High Irradiance Responsivity . . .
2.3 kHz/(mW/cm2) at λp = 524 nm
D Low Dark Frequency . . . < 2 Hz at 255 C
D Single-Supply Operation . . . 2.7 V to 5.5 V
D Stable 200 ppm/°C Temperature Coefficient
D Interfaces Directly to a Microcontroller
D Lead (Pb) Free Package
D RoHS Compliant
TSL238
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS073J − SEPTEMBER 2008
PACKAGE D
8-LEAD SOIC
(TOP VIEW)
NC 1
NC 2
NC 3
NC 4
8 OUT
7 VDD
6 GND
5 OE
Description
The TSL238 light-to-frequency converter combines a silicon photodiode and a current-to-frequency converter
on a single monolithic CMOS integrated circuit. Output is a square wave (50% duty cycle) with frequency directly
proportional to light intensity (irradiance) on the photodiode. The digital output allows direct interface to a
microcontroller or other logic circuitry. Output enable (OE) places the output in a high-impedance state for
multiple-unit sharing of a microcontroller input line. The device has been temperature compensated for the
ultraviolet-to-visible light range of 320 nm to 700 nm and responds over the light range of 320 nm to 1050 nm.
The TSL238 is characterized for operation over the temperature range of −40°C to 85°C and is supplied in an
8-lead plastic small outline package. When supplied in the lead (Pb) free package, the device is RoHS
compliant.
For automotive and other extended temperature applications, please contact TAOS for information.
Functional Block Diagram
Light
Photodiode
Current-to-Frequency
Converter
Output
Available Options
DEVICE
TSL238
TA
−25°C to 70°C
PACKAGE − LEADS
8-lead Plastic Small Outline IC
PACKAGE DESIGNATOR ORDERING NUMBER
D TSL238D
The LUMENOLOGY r Company
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972r) 673-0759
www.taosinc.com
Copyright E 2008, TAOS Inc.
1
1 page  
TSL238
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS073J − SEPTEMBER 2008
TYPICAL CHARACTERISTICS
NORMALIZED OUTPUT FREQUENCY
vs.
ANGULAR DISPLACEMENT
1
DARK FREQUENCY
vs.
FREE-AIR TEMPERATURE
7.5
6.0
0.8 4.5
3.0
0.6 1.5
0.0
0.4 −1.5
0.2
Angular Displacement is
Equal for Both Aspects
−3.0
−4.5
−6.0
NOTE A
0
−90 −60 −30 0 30 60
Q − Angular Displacement − °
90
−7.5
−25
−5 15 35 55
TA − Free-Air Temperature − °C
75
Figure 5
Figure 6
NOTE A: Internal offsets that result in dark frequency can be both positive and negative. The dashed line represents the case of negative offset
in which an equivalent amount of light signal is required to obtain a non-zero output frequency.
PHOTODIODE RESPONSIVITY TEMPERATURE
COEFFICIENT vs.
WAVELENGTH OF INCIDENT LIGHT
11k
10k
9k
8k
7k
6k
5k
4k
3k
2k
1k
0
600 650 700 750 800 850 900 950 1000
λ − Wavelength of Incident Light − nm
Figure 7
The LUMENOLOGY r Company
r
www.taosinc.com
r
Copyright E 2008, TAOS Inc.
5
5 Page 
TSL238
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS073J − SEPTEMBER 2008
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To prevent
these adverse conditions, all devices shipped in carrier tape have been pre-baked and shipped in a sealed
moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within
24 hours of the seal being broken on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
The LUMENOLOGY r Company
r
www.taosinc.com
r
Copyright E 2008, TAOS Inc.
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TSL238.PDF ] | |
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