TR0402 데이터시트 PDF

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DATA SHEET

TRIMMABLE CHIP RESISTORS

TR series

0/-10%, 0/-20%, 0/-30%

sizes 0402/0603/0805/1206

RoHS compliant

Product specification 4

Chip Resistor Surface Mount TR SERIES 0402/0603/0805/1206 (RoHS Compliant)

8

MARKING

TR0402/0603/0805/1206

Fig. 1

No marking

ynsc007

For further marking information, please see special data sheet “Chip resistors marking”.

CONSTRUCTION

The resistors are constructed on a high-grade ceramic

body (aluminium oxide). Internal metal electrodes are

added at each end and a connection is made between

them using a resistive metal glaze; the approximate

resistor values are dependent on the composition of

the glaze.

The resistive layer is covered with a translucent

protective coat. Finally, two end electrodes are added,

the composition of which has been designed to provide

ease of soldering. See fig. 2.

DIMENSIONS

Table 1 For outlines see fig. 2

TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm)

TR0402 1.00 ±0.10 0.50 ±0.05 0.35 ±0.05 0.20 ±0.10 0.25 ±0.10

TR0603 1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15

TR0805 2.00 ±0.10 1.25 ±0.10 0.50 ±0.10 0.35 ±0.20 0.35 ±0.20

TR1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.40 ±0.20

OUTLINES

For dimension see Table 1

H

I2

I1

W

L

Fig. 2 Chip resistor outlines

overcoat

protective glass

resistive layer

(Jumper chip is a conductor)

inner electrode

termination(Ni/matte tin)

inner electrode

ceramic substrate

overcoat

YNSC056

ELECTRICAL CHARACTERISTICS

Table 2

TYPE

RESISTANCE

RANGE

Rated

Power

Operating

Temperature

Range

Max.

Working

Voltage

CHARACTERISTICS

Max. Dielectric

Overload Withstanding

Voltage

Voltage

Temperature Coefficient

of Resistance

TR0402

1/16 W

TR0603 0/-10%, 0/-20%, 0/-30%: 1/16 W

1 Ω to 10 MΩ

TR0805

(E-24) 1/8 W

TR1206

1/4 W

–55 °C to

+125 °C

–55 °C to

+155 °C

50 V

50 V

150 V

200 V

100 V

100 V

300 V

500 V

100 V

100 V

500 V

500 V

1 Ω ≤ R ≤ 10 Ω: ±200 ppm/°C

10 Ω < R ≤ 1 MΩ: ±100 ppm/°C

1 MΩ < R ≤ 10 MΩ: ±200 ppm/°C

Jan 14, 2009 V.1

www.yageo.com

Product specification 7

Chip Resistor Surface Mount TR SERIES 0402/0603/0805/1206 (RoHS Compliant)

8

TEST

Solderability

- Wetting

TEST METHOD

PROCEDURE

IPC/JEDECJ-STD-002B test B

IEC 60068-2-58

Electrical Test not required

Magnification 50X

SMD conditions:

1st step: method B, aging 4 hours at 155 °C

dry heat

2nd step: leadfree solder bath at 245±3 °C

Dipping time: 3±0.5 seconds

- Leaching

IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds

IEC 60068-2-58

immersion time

- Resistance to

Soldering Heat

MIL-STD-202G-method 210F

IEC 60068-2-58

Condition B, no pre-heat of samples

Leadfree solder, 270 °C, 10 seconds

immersion time

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

REQUIREMENTS

Well tinned (≥95% covered)

No visible damage

No visible damage

±(1%+0.05 Ω)

No visible damage

Jan 14, 2009 V.1

www.yageo.com

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