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LDH65100PAAA-400 데이터시트 PDF




Murata Manufacturing에서 제조한 전자 부품 LDH65100PAAA-400은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 LDH65100PAAA-400 자료 제공

부품번호 LDH65100PAAA-400 기능
기능 Chip Multilayer Delay Lines
제조업체 Murata Manufacturing
로고 Murata Manufacturing 로고


LDH65100PAAA-400 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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LDH65100PAAA-400 데이터시트, 핀배열, 회로
!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocnt ss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacl tsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
Chip Multilayer Delay Lines
Chip Multilayer Delay Lines
1
3.2±0.2
1.1±0.2
This Delay Line was developed by applying ceramic
(3) (2) (1)
multilayering and hole technology. It consists of
copper line and low dielectric constant material and
incorporates metal shields. LDH series are very small
(4) (8)
(5) (6) (7)
0.25+0.1/-0.15
and made for use at high frequencies.
0.35±0.2 0.45±0.15
s Features
(1)(3)(5)(7) : NC
(2)(6) : GND
(4)(8) : IN/OUT
1. High stability at high frequency (2GHz)
0.5±0.1
1.0±0.1
(in mm)
2. Small, thin and light, utilizing multilayer
construction
m3. Metal shield is built inside chip.
4. Reflow solderable
o5. Supplied on tape
Sheet4U.c0.6±0.1
.DataDirectional
Input Mark
(1) (2) (3)
(8) (4)
(7) (6) (5)
0.4±0.2
4.5±0.2
1.1±0.2
wwwLDH43 Series
0.35±0.10
1.27±0.10
(1)(3)(4)(5)(7)(8) : GND
(2)(6)
: IN/OUT
(in mm)
All the technical data and information contained herein are
subject to change without prior notice.
LDH31 Series
Terminal of "NC" should not be fixed to any pattern.
All the technical data and information contained herein are subject
to change without prior notice.
3.2±0.2
(3) (2) (1)
1.5±0.15
(4) (8)
LDH32 Series
(5) (6) (7)
0.1min. 0.45±0.15 1.0±0.2
0.55±0.15
0.4±0.2
(1)(3)(5)(7) : NC
(2)(6) : GND
(4) : IN/OUT
(8) : IN/OUT
(in mm)
Terminal of "NC" should not be fixed
to any pattern.
All the technical data and information
contained herein are subject to
change without prior notice.
LDH54 Series
5.0±0.3
1.1–3.1 1.27±0.2
0.3max.
(1) (2) (3)
0.35±0.2
(6) (5) (4)
0.8±0.2
1.27±0.2
(1)(3) : IN / OUT
(2)(4)
(5)(6)
:
GND
(in mm)
LDH65 Series
6.3±0.3
0.6 min. 0.4 min.
0.5 min. 1.27±0.2
2.5 max.
0.5 min. 0.3 max.
(1) (2) (3) (4)
(8) (7) (6) (5)
(1)(5) : IN / OUT
(2)(3)(4)
(6)(7)(8)
:
GND
(in mm)
www.DataSheet4U.comLDHA2 Series
10.0±0.3
0.5 min. 0.4 min.
0.4 min. 2.54±0.2
3.7 max.
0.8 min. 0.3 max.
(1) (2) (3) (4)
(10) (5)
(9) (8) (7) (6)
1.4±0.3
(1)(6) : IN / OUT
(2)(3)(4)
(5)(7)(8)
: GND
(9)(10)
(in mm)
Cat.No.N91E-71




LDH65100PAAA-400 pdf, 반도체, 판매, 대치품
!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocntss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacltsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
1 Soldering and Mounting
s Standard Land Dimensions
LDH31 Series
1.00 2.60 1.00
0.60
LDH32 Series
1.5 2.2 1.5
Land
Solder resist
No pattern
Solder resist
0.70
0.30
0.30
1.05
0.25
0.45
Land
Solder resist
No pattern Solder resist
Line width to be designd to match 50ohm
characteristic impedance, depending
on PCB material and thickness.
All the technical data and Information
contained herein are subject
to change without prior notice.
(in mm)
1.0
0.4
1.25 0.05
0.7 0.3 0.7
Line width to be designed to match 50characteristic impedance,
depending on PCB material and thickness.
All the technical data and Information contained
herein are subject to change without prior notice.
(in mm)
LDH43 Series
0.6
3.5
1.0
0.6 1.27
(in mm)
Land
All the technical data and information contained herein are subject to change without prior notice.
LDH54 Series
0.37 0.37
0.9 0.9 0.9
Land
Solder resist
No pattern
Solder resist
Line width to be designed to match 50ohm characteristic
impedance, depending on PCB material and thickness.
(in mm)
LDH65 Series
Land
Solder Resist
No Pattern
Solder Resist
LDHA2 Series
*
*
Land
Solder Resist
No Pattern
Solder Resist
**
0.37
2.17
2.91
4.71
* Line width to be designed to match 50characteristic
impedance, depending on PCB material and thickness.
(in mm)
1.34
3.74
6.42
6.6
8.82
11.0
* Line width to be designed to match 50characteristic
impedance, depending on PCB material and thickness.
(in mm)
4

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LDH65100PAAA-400 전자부품, 판매, 대치품
!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
N91E7.pdf 03.5.13
TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocntss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacltsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering.
s Notice (Storage and Operating Condition)
To avoid damaging the solderability of the external
electrodes, be sure to observe the following points.
o Store products where the ambient temperature is 15 to
35°C and the relative humidity is 45 to 75% RH.
(Packing materials, in particular, may be deformed at
temperatures over 40°C.).
o Bulk packed chip components should be used as soon as
the seal is opened, thus preventing the solderability from
deteriorating. The remaining unused components should
be put in the original bag and resealed, or stored in a
desiccator containing a desiccating agent.
o Store products in non-corrosive gas (Cl2, NH3, SO2, Nox,
etc.).
o Stored products should be used within 6 months of
receipt. Solderability should be verified if this period is
exceeded.
s Notice (Rating)
Products should be used in an input power capacity as
specified in this catalog.
Consult with Murata beforehand if a different input
power capacity range is required.
Notice 1
7

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관련 데이터시트

부품번호상세설명 및 기능제조사
LDH65100PAAA-400

Chip Multilayer Delay Lines

Murata Manufacturing
Murata Manufacturing

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