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PDF CHY100 Data sheet ( Hoja de datos )

Número de pieza CHY100
Descripción Charger Interface Physical Layer IC
Fabricantes Power Integrations 
Logotipo Power Integrations Logotipo



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CHY100
ChiPhyFamily
Charger Interface Physical Layer IC
Product Highlights
Fully supports Quick Charge 2.0 specification
Class A: 5 V, 9 V, and 12 V output voltage
Class B: 5 V, 9 V, 12 V, and 20 V output voltage
USB battery charging specification revision 1.2 compatible
Automatic USB DCP shorting D+ to D- line
Default 5 V mode operation
Supports TOPSwitch and TinySwitch
Very low power consumption
Below 1 mW at 5 V output
Fail safe operation
Adjacent pin-to-pin short-circuit fault
Open circuit pin fault
Typical Applications
Battery chargers for smart phones, tablets, netbooks, digital
cameras, and bluetooth accessories
USB power output ports
Description
CHY100 is a low-cost USB high-voltage dedicated charging port
(HVDCP) interface IC for the Quick Charge 2.0 specification. It
incorporates all necessary functions to add Quick Charge 2.0
capability to Power Integrations’ switcher ICs such as TOPSwitch
or TinySwitch and other solutions employing traditional feedback
schemes.
CHY100 supports the full output voltage range of either Class A
or Class B. Optionally Class B can be inhibited for protecting the
battery charger from accidental damage.
CHY100 automatically detects whether a connected Powered
Device (PD) is Quick Charge 2.0 capable before enabling output
voltage adjustment. If a PD not compliant to Quick Charge 2.0 is
detected the CHY100 disables output voltage adjustment to
ensure safe operation with legacy 5 V only USB PDs.
VOUT
D+
D-
GND
Feedback
Network
BP
V3 D+
V2 CHY100 D-
U1
V1 R
GND
Figure 1. Typical Application Schematic.
PI-6988-071713
Figure 2. Package Option.
SO-8 (D Package)
www.powerint.com
This Product is Covered by Patents and/or Pending Patent Applications.
March 2014

1 page




CHY100 pdf
CHY100
SO-8 (D Package)
4B
2
4.90 (0.193) BSC
0.10 (0.004) C A-B 2X
A
8
4
D
5
2 3.90 (0.154) BSC
0.10 (0.004) C D
2X Pin 1 ID
1.27 (0.050) BSC
1
1.35 (0.053)
1.75 (0.069)
0.10 (0.004)
0.25 (0.010)
1.25 - 1.65
(0.049 - 0.065)
6.00 (0.236) BSC
SEATING
PLANE
C
1.04 (0.041) REF
4 0.20 (0.008) C
2X
7X 0.31 - 0.51 (0.012 - 0.020)
0.25 (0.010) M C A-B D
0.40 (0.016)
1.27 (0.050)
0.10 (0.004) C
7X
SEATING PLANE
C
H
0.17 (0.007)
0.25 (0.010)
DETAIL A
GAUGE
PLANE
0 - 8o
0.25 (0.010)
BSC
DETAIL A
Reference
Solder Pad
Dimensions
+
1.45 (0.057) 4.00 (0.157) 5.45 (0.215)
D08A
1.27 (0.050)
++
+
0.60 (0.024)
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
5. Controlling dimensions are in millimeters. Inch dimensions
are shown in parenthesis. Angles in degrees.
PI-5615-041210
Part Ordering Information
CHY 100 D
www.powerint.com
• ChiPhy Product Family
• 100 Series Number
• Package Identifier
D SO-8
5
Rev. C 03/14

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