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MPXV7007G6U 데이터시트 PDF




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부품번호 MPXV7007G6U 기능
기능 Integrated Silicon Pressure Sensor
제조업체 Freescale Semiconductor
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MPXV7007G6U 데이터시트, 핀배열, 회로
Freescale Semiconductor
+ Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7007 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin-
film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
• 5.0% Maximum Error Over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over –40° to +125°C
• Thermoplastic (PPS) Surface Mount Package
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations
Pressure
MPXV7007
Rev 1, 1/2009
MPXV7007
Series
-7 to 7 kPa (-1 to 1 psi)
0.5 to 4.5 V Output
Application Examples
• Hospital Beds
• HVAC
• Respiratory Systems
• Process Control
Device Name
Small Outline Package
MPXV7007GC6U
MPXV7007GC6T1
MPXV7007GP
MPXV7007DP
MPXV7007G6T1
MPXV7007G6U
Package
Options
Rails
Tape & Reel
Trays
Trays
Tape & Reel
Rails
Case
No.
ORDERING INFORMATION
# of Ports
Pressure Type
None Single Dual Gauge Differential Absolute
Device
Marking
482A
482A
1369
1351
482
482
••
••
••
••
••
MPXV7007G
MPXV7007G
MPXV7007GP
MPXV7007DP
MPXV7007G
MPXV7007G
SMALL OUTLINE PACKAGE
MPXV7007G6T1/U
CASE 482-01
MPXV7007GC6U/C6T1
CASE 482A-01
MPXV7007GP
CASE 1369-01
MPXV7007DP
CASE 1351-01
© Freescale Semiconductor, Inc., 2005, 2009. All rights reserved.




MPXV7007G6U pdf, 반도체, 판매, 대치품
Pressure
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A fluorosilicone gel
isolates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the
sensor diaphragm.
The MPXV7007 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Fluoro Silicone
Gel Die Coat
Wire Bond
Lead
Frame
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
Differential Sensing
Element
P2
Die Bond
Figure 2. Cross-Sectional Diagram SOP
(not to scale)
+5 V
1.0 µF
Vout
Vs
IPS
0.01 µF
GND
OUTPUT
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
MPXV7007
4
Sensors
Freescale Semiconductor

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MPXV7007G6U 전자부품, 판매, 대치품
5
N -B-
8
-A-
S
J
K
PACKAGE DIMENSIONS
Pressure
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
V
C
M
W
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.500 0.520
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M
N 0.444 0.448
S 0.709 0.725
V 0.245 0.255
W 0.115 0.125
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
12.70 13.21
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
11.28 11.38
18.01 18.41
6.22 6.48
2.92 3.17
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
5
-B-
8
J
K
-A-
S
N
D 8 PL
4 0.25 (0.010) M T B S A S
G
1
C
M
PIN 1 IDENTIFIER
H
-T-
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
DIM MIN MAX
A 0.415 0.425
B 0.415 0.425
C 0.212 0.230
D 0.038 0.042
G 0.100 BSC
H 0.002 0.010
J 0.009 0.011
K 0.061 0.071
M
N 0.405 0.415
S 0.709 0.725
MILLIMETERS
MIN MAX
10.54 10.79
10.54 10.79
5.38 5.84
0.96 1.07
2.54 BSC
0.05 0.25
0.23 0.28
1.55 1.80
0˚ 7˚
10.29 10.54
18.01 18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
Sensors
Freescale Semiconductor
MPXV7007
7

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관련 데이터시트

부품번호상세설명 및 기능제조사
MPXV7007G6T1

Integrated Silicon Pressure Sensor

Freescale Semiconductor
Freescale Semiconductor
MPXV7007G6U

Integrated Silicon Pressure Sensor

Freescale Semiconductor
Freescale Semiconductor

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