|
|
|
부품번호 | MPXV5050G 기능 |
|
|
기능 | Integrated Silicon Pressure Sensor | ||
제조업체 | Freescale Semiconductor | ||
로고 | |||
전체 18 페이지수
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXx5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated Over -40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
Pressure
MPX5050
Rev 10, 10/2009
MPX5050
MPXV5050
MPVZ5050
Series
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 V Output
ORDERING INFORMATION
Device Name
Case
No.
Unibody Package (MPX5050 Series)
None
# of Ports
Single
Dual
Gauge
MPX5050D
867 •
MPX5050DP
867C
MPX5050GP
867B
MPX5050GP1
867B
Small Outline Package (MPXV5050 Series)
•
•
•
•
•
MPXV5050GP
1369
•
MPXV5050DP
1351
•
MPXV5050GC6U
482A
•
MPXV5050GC6T1
482A
•
Small Outline Package (Media Resistant Gel) (MPVZ5050 Series)
•
•
•
MPVZ5050GW7U
1560
•
•
Pressure Type
Differential Absolute
•
•
•
Device
Marking
MPX5050D
MPX5050DP
MPX5050GP
MPX5050GP
MPXV5050GP
MPXV5050DP
MPXV5050G
MPXV5050G
MZ5050GW
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Maximum Pressure (P1 > P2)
Storage Temperature
Operating Temperature
Pmax
Tstg
TA
200
-40° to +125°
-40° to +125°
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Sensing
Element
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 4, 5, and 6 are NO CONNECTS
for Unibody Device
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic
Unit
kPa
°C
°C
MPX5050
4
Sensors
Freescale Semiconductor
4페이지 5
N –B–
8
–A–
S
J
K
PACKAGE DIMENSIONS
Pressure
4
G
1
V
C
M
D 8 PL
0.25 (0.010) M T B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
W
H
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.038 0.042 0.96 1.07
G 0.100 BSC
2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0_ 7_ 0_ 7_
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17
–T–
PIN 1 IDENTIFIER
SEATING
PLANE
CASE 482A-01
ISSUE A
UNIBODY PACKAGE
C
B
J
S
M
-A-
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE
(P1)
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
PIN 1
SEATING
PLANE
-T-
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
Sensors
Freescale Semiconductor
MPX5050
7
7페이지 | |||
구 성 | 총 18 페이지수 | ||
다운로드 | [ MPXV5050G.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
MPXV5050 | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
MPXV5050DP | Integrated Silicon Pressure Sensor | Freescale Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |