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PDF MC54HC00A Data sheet ( Hoja de datos )
| Número de pieza | MC54HC00A | |
| Descripción | Quad 2-Input NAND Gate | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input NAND Gate
High–Performance Silicon–Gate CMOS
The MC54/74HC00A is identical in pinout to the LS00. The device
inputs are compatible with Standard CMOS outputs; with pullup resistors,
they are compatible with LSTTL outputs.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 2 to 6V
• Low Input Current: 1µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance With the JEDEC Standard No. 7A Requirements
• Chip Complexity: 32 FETs or 8 Equivalent Gates
LOGIC DIAGRAM
1
A1
2
B1
4
A2
5
B2
9
A3
10
B3
12
A4
13
B4
PIN 14 = VCC
PIN 7 = GND
3
Y1
6
Y2
Y = AB
8
Y3
11
Y4
Pinout: 14–Lead Packages (Top View)
VCC B4 A4 Y4 B3 A3 Y3
14 13 12 11 10 9 8
MC54/74HC00A
14
1
14
1
14
1
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC54HCXXAJ
MC74HCXXAN
MC74HCXXAD
MC74HCXXADT
Ceramic
Plastic
SOIC
TSSOP
FUNCTION TABLE
Inputs
Output
AB
Y
LL
LH
HL
HH
H
H
H
L
1234567
A1 B1 Y1 A2 B2 Y2 GND
10/95
© Motorola, Inc. 1995
1
REV 7
1 page  
MC54/74HC00A
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
-A-
14 8
-B-
17
C
-T-
SEATING
PLANE
F
GN
D 14 PL
0.25 (0.010) M T A S
K
L
M
J 14 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.94
B 0.245 0.280 6.23 7.11
C 0.155 0.200 3.94 5.08
D 0.015 0.020 0.39 0.50
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M 0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
14
1
A
F
HG
8
B
7
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
C
N
SEATING
PLANE
D
K
L
J
M
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC
2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC
7.62 BSC
M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01
High–Speed CMOS Logic Data
DL129 — Rev 6
5
MOTOROLA
5 Page | ||
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| PDF Descargar | [ Datasheet MC54HC00A.PDF ] | |
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