PDF uP7701 Data sheet ( Hoja de datos )

Número de pieza	uP7701
Descripción	3A Ultra Low Dropout Linear Regulator
Fabricantes	uPI Semiconductor
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No Preview Available ! uP7701 3A Ultra Low Dropout Linear Regulator General Description Features The uP7701 is a 3A ultra low dropout linear regulator specifically designed for motherboard,notebook and graphic card applications. This device works with dual supplies, a control input for the control circuitry and a power input as low as 1.0V for providing current to output. The uP7701 delivers high-current and ultra-low-drop output voltage as low as 0.8V for applications where VOUT is very close to VIN. The uP7701 features comprehensive control and protection functions: a power on reset (POR) circuit for monitoring both control and power inputs for proper operation; an EN input for enabling or disabling the device, a power OK with time delay for indicating the output voltage status, a foldback current limit function, and a thermal shutdown function. The uP7701 is available in PSOP-8 package with very low thermal resistance. Applications Desktop PCs, Notebooks, and Workstations Graphic Cards Low Voltage Logic Supplies Microprocessor and Chipset Supplies Split Plane Microprocessor Supplies Advanced Graphics Cards Supplies SoundCards and Auxiliary Power Supplies SMPS Post Regulators Works with 1.0V~5.5V VIN Adjustable Output Voltage, Down to 0.8V 1.5% Initial Accuracy Excellent Line and Load Regulation 3A Guaranteed Output Current 300mV @ 3A Dropout Voltage Very Low On-Resistance 100mΩ typical VOUT Pull Low Resistance when Disabled Low Reverse Leakage (Output to Input ) VOUT Power OK Signal Fast Transient Response Low External Component Count Low Cost and Easy to Use Enable Pin Over Current and Over Temperature Protection Ordering Information Order Number uP7701U8 Package Type PSOP-8 Remark Note: uPI products are compatible with the current IPC/ JEDEC J-STD-020 and RoHS requirements. They are 100% matte tin (Sn) plating and suitable for use in SnPb or Pb- free soldering processes. Pin Configuration & Typical Application Circuit POK EN VIN CNTL 18 27 GND 36 45 uP7701 GND FB VOUT NC 5VCC R4 10R VIN C1 1uF C2 4.7uF CNTL EN 2 4 POK 1 VIN 3 VOUT 6 NC 5 FB 7 8 GND R3 10K R2 12.5K R1 10K VOUT C4 option C3 10uF uPI Semiconductor Corp., http://www.upi-semi.com Rev. 00, 2007, April 1 1 page uP7701 Electrical Characteristics Parameter Symbol Feedback Voltage (VREFIN = VCNTL) On Resistance RDS(ON) Dropout Voltage VDROP VOUT Pull Low Resistance Enable Test Conditions IOUT = 100mA, VCNTL = VEN = 5.0V, VOUT = 1.6V IOUT = 2A, VCNTL = VEN = 5.0V, VOUT = 1.6V, by design IOUT = 3A, VCNTL = VEN = 5.0V, VOUT = 1.6V, by design VCNTL = VIN = 5.0V, VEN = 0V, by design Enable High Level Disable Low Level EN Source Current EN Input Impedance PWROK VEN VSD IEN ZEN VEN = 0V, VCNTL = 5.0V FB Power OK Threshold Power OK Hysteresis POK Delay Time VPOKTH VPOKHYS Overcurrent Protection OCP Threshold Level Output Short Circuit Current IOCP ISC Thermal Protection Thermal Shutdown Temperature TSD Thermal Shutdown Hysteresis TSDHYS IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF From VOUT > 92% VNOM to POK rising VCNTL = VIN = VEN = 5.0V, VOUT = VREF VCNTL = VIN = VEN = 5.0V, VOUT = 0V IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF Min Typ Max Units -- 100 120 mΩ -- 200 240 mV 300 360 -- 90 -- Ω -- -- 1.6 V 0.4 -- -- V -- 12 20 uA -- 65 -- KΩ -- 92 -- % -- 8 -- % -- 1 -- ms 3.5 -- -- 100 -- -- A mA -- 170 -- -- 30 -- OC OC Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions. uPI Semiconductor Corp., http://www.upi-semi.com Rev. 00, 2007, April 5 5 Page 0.76 REF 1.27 REF 2.39 REF uP7701 Application Information 4.80 - 5.00 2.29 BSC 1.27 BSC 0.32 - 0.52 Recommended Solder Pad Layout 1.45 - 1.60 0.20 BSC 0.41 - 0.89 0.18 - 0.25 1.75 MAX 3.81 BSC 0.10 - 0.25 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm. uPI Semiconductor Corp., http://www.upi-semi.com Rev. 00, 2007, April 11 11 Page

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