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MKV31F256VLH12 데이터시트, 핀배열, 회로
Freescale Semiconductor, Inc.
Data Sheet: Technical Data
KV31P100M120SF8
Rev. 5, 4/2015
Kinetis KV31F 256 KB Flash
120 MHz ARM® Cortex®-M4-Based Microcontroller with FPU
The KV31 MCU family is a highly scalable member of the Kinetis
V Series and provides a high-performance, cost-competitive
motor control solution. Built on the ARM®Cortex®-M4 core
running at 120 MHz, combined with floating point and DSP
capability, it delivers a highly capable platform enabling
customers to build a highly scalable solution portfolio.
Additional features include:
• Dual 16-bit ADCs sampling at up to 1.2 MS/s in 12-bit
mode
• 12 channels of highly flexible motor control timers (PWMs)
across 3 independent time bases
• Large RAM block enabling local execution of fast control
loops at full clock speed
MKV31F256VLL12
MKV31F256VLH12
100 LQFP (LL)
64 LQFP (LH)
14 x 14 x 1.4 Pitch 0.5 10 x 10 x 1.4 Pitch 0.5
mm mm
Performance
• 120 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• 256 KB of embedded flash and 48 KB of RAM
• Serial programming interface (EzPort)
• Preprogrammed Kinetis flashloader for one-time, in-
system factory programming
System peripherals
• Flexible low-power modes, multiple wake up sources
• 16-channel DMA controller
• Independent external and software watchdog monitor
Clocks
• One crystal oscillator, two ranges: 32-40 kHz or 3-32
MHz
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
• Multi-purpose clock generator with PLL and FLL
Analog modules
• Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode)
• One 12-bit DAC
• Two analog comparators (CMP) with 6- bit DAC
• Accurate internal voltage reference
Communication interfaces
• Two SPI modules
• Three UART modules and one low-power UART
• Two I2C modules: Support for up to 1 Mbps
operation
Timers
• One 8-channel motor control/general purpose/ PWM
timer
• Two 2-channel motor control/general purpose timers
with quadrature decoder functionality
• Periodic interrupt timers
• 16-bit low-power timer
• Programmable delay block
Security and integrity modules
• Hardware CRC module
• 128-bit unique identification (ID) number per chip
• Hardware random-number generator
• Flash access control to protect proprietary software
Operating Characteristics
• Voltage range (including flash writes): 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
Human-machine interface
• Up to 70 general-purpose I/O (GPIO)
© 2014–2015 Freescale Semiconductor, Inc. All rights reserved.




MKV31F256VLH12 pdf, 반도체, 판매, 대치품
Table of Contents
1 Ratings................................................................................................5
1.1 Thermal handling ratings........................................................... 5
1.2 Moisture handling ratings.......................................................... 5
1.3 ESD handling ratings................................................................. 5
1.4 Voltage and current operating ratings........................................5
2 General............................................................................................... 6
2.1 AC electrical characteristics...................................................... 6
2.2 Nonswitching electrical specifications...................................... 6
2.2.1 Voltage and current operating requirements................ 6
2.2.2 LVD and POR operating requirements........................ 7
2.2.3 Voltage and current operating behaviors......................8
2.2.4 Power mode transition operating behaviors................. 9
2.2.5 Power consumption operating behaviors..................... 10
2.2.6 EMC radiated emissions operating behaviors.............. 15
2.2.7 Designing with radiated emissions in mind................. 16
2.2.8 Capacitance attributes...................................................16
2.3 Switching specifications............................................................ 16
2.3.1 Device clock specifications.......................................... 16
2.3.2 General switching specifications..................................17
2.4 Thermal specifications...............................................................17
2.4.1 Thermal operating requirements.................................. 18
2.4.2 Thermal attributes.........................................................18
3 Peripheral operating requirements and behaviors.............................. 19
3.1 Core modules............................................................................. 19
3.1.1 SWD electricals ...........................................................19
3.1.2 JTAG electricals........................................................... 20
3.2 System modules......................................................................... 23
3.3 Clock modules........................................................................... 23
3.3.1 MCG specifications......................................................23
3.3.2 IRC48M specifications.................................................26
3.3.3 Oscillator electrical specifications................................26
3.4 Memories and memory interfaces..............................................28
3.4.1 Flash electrical specifications.......................................28
3.4.2 EzPort switching specifications....................................30
3.5 Security and integrity modules.................................................. 31
3.6 Analog........................................................................................31
3.6.1 ADC electrical specifications.......................................31
3.6.2 CMP and 6-bit DAC electrical specifications.............. 36
3.6.3 12-bit DAC electrical characteristics........................... 38
3.6.4 Voltage reference electrical specifications...................41
3.7 Timers........................................................................................ 42
3.8 Communication interfaces......................................................... 42
3.8.1 DSPI switching specifications (limited voltage range) 43
3.8.2 DSPI switching specifications (full voltage range)......44
3.8.3 Inter-Integrated Circuit Interface (I2C) timing............ 46
3.8.4 UART switching specifications....................................47
4 Dimensions.........................................................................................48
4.1 Obtaining package dimensions.................................................. 48
5 Pinout................................................................................................. 48
5.1 KV31F Signal Multiplexing and Pin Assignments....................48
5.2 KV31F Pinouts.......................................................................... 52
6 Part identification............................................................................... 54
6.1 Description.................................................................................54
6.2 Format........................................................................................55
6.3 Fields..........................................................................................55
6.4 Example..................................................................................... 56
7 Revision History.................................................................................56
4
Freescale Semiconductor, Inc.
Kinetis KV31F 256 KB Flash, Rev. 5, 4/2015

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MKV31F256VLH12 전자부품, 판매, 대치품
General
Table 1. Voltage and current operating requirements (continued)
Symbol Description
VDDA Analog supply voltage
VDD – VDDA VDD-to-VDDA differential voltage
VSS – VSSA VSS-to-VSSA differential voltage
VIH Input high voltage
• 2.7 V ≤ VDD ≤ 3.6 V
• 1.7 V ≤ VDD ≤ 2.7 V
VIL Input low voltage
• 2.7 V ≤ VDD ≤ 3.6 V
• 1.7 V ≤ VDD ≤ 2.7 V
VHYS
IICIO
Input hysteresis
Analog and I/O pin DC injection current — single pin
• VIN < VSS-0.3V (Negative current injection)
IICcont
Contiguous pin DC injection current —regional limit,
includes sum of negative injection currents or sum of
positive injection currents of 16 contiguous pins
• Negative current injection
Min.
1.71
–0.1
–0.1
0.7 × VDD
0.75 × VDD
Max.
3.6
0.1
0.1
— 0.35 × VDD
— 0.3 × VDD
0.06 × VDD
-3
-25 —
Unit
V
V
V
V
V
V
V
V
mA
mA
VODPU
VRAM
Open drain pullup voltage level
VDD voltage required to retain RAM
VDD
VDD
1.2 —
V
V
Notes
1
2
1. All analog and I/O pins are internally clamped to VSS through ESD protection diodes. If VIN is less than VIO_MIN or
greater than VIO_MAX, a current limiting resistor is required. The negative DC injection current limiting resistor is
calculated as R=(VIO_MIN-VIN)/|IICIO|.
2. Open drain outputs must be pulled to VDD.
2.2.2 LVD and POR operating requirements
Table 2. VDD supply LVD and POR operating requirements
Symbol Description
Min.
Typ.
Max.
Unit
VPOR
VLVDH
Falling VDD POR detect voltage
Falling low-voltage detect threshold — high
range (LVDV=01)
0.8 1.1 1.5
2.48 2.56 2.64
V
V
Low-voltage warning thresholds — high range
VLVW1H
VLVW2H
VLVW3H
VLVW4H
• Level 1 falling (LVWV=00)
• Level 2 falling (LVWV=01)
• Level 3 falling (LVWV=10)
• Level 4 falling (LVWV=11)
2.62 2.70 2.78
2.72 2.80 2.88
2.82 2.90 2.98
2.92 3.00 3.08
V
V
V
V
Table continues on the next page...
Notes
1
Kinetis KV31F 256 KB Flash, Rev. 5, 4/2015
7
Freescale Semiconductor, Inc.

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