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부품번호 | CSL0701UT 기능 |
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기능 | LEDs | ||
제조업체 | ROHM Semiconductor | ||
로고 | |||
전체 8 페이지수
CSL07 series
lFeatures
• Compact and lower height LEDs with lens.
• Available for both top-view and side view usages.
lSize
100269(2044(0121)10)
1.0×2.09.×6m2m.4m(t=m0.(2t=m3m.1)mm)
lDimensions
Color
Type
U
D
lOutline
Data Sheet
lRecommended Solder Pattern
1.5 1.9 1.5
Tolerance : 0.2
(unit : mm)
(unit : mm)
lSpecifications
Part No.
CSL0701UT
CSL0701DT
Chip
Structure
Emitting
Color
Absolute Maximum Ratings (Ta=25ºC)
Power Forward Peak Forward Reverse
Operating Temp. Storage Temp.
Dissipation Current Current Voltage
PD(mW) IF(mA) IFP(mA) VR(V) Topr(ºC)
Tstg(ºC)
Electrical and Optical Characteristics (Ta=25ºC)
Forward Voltag VF Reverse Current IR Dominant Wavelength lD Luminous Intensity IV
Typ. IF Max. VR Min.*2 Typ. Max.*2 IF Min. Typ. IF
(V) (mA) (mA) (V) (nm) (nm) (nm) (mA) (cd) (cd) (mA)
Red
(619) 624 (629)
9 18
AlGaInP
120 50 150*1 5 -40 to +85 -40 to +100 2.1 20 10 5
20 20
Orange
(599) 605 (611)
20 35
*1 : Duty 1/10, 1kHz
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
1/7
2015.03 - Rev.B
CSL07 series
lTaping
φ
1
.
5
+
0
0
.
1
(Feeding holes)
4 ±0.1
2 ±0.05
←B
0.4 ±0.05
↑↑
A A'
8 ±0.1
← B'
3.2 ±0.1
A-A' cross sectional view
2.85 ±0.1
B-B' cross sectional view
17.4 ±1
Data Sheet
lPart No. Construction
Packing quantity
2,000pcs/reel
Pull
direction
Tolerance : 0.2mm
(unit : mm)
lPacking Specification
ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags.
Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card
inside the bag is available upon request.
Please contact the nearest sales office or distributer if necessary.
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
4/7
2015.03 - Rev.B
4페이지 CSL07 Series
Data Sheet
4-4. Mechanical Stress after Mounting
The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on
product.
Stress strength according to
the mounting position:
A>B>C>D
4-5. Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right. It will be
different according to mounting situation of circuit board, therefore, please
concern before designing.
*The product has adopted the electrode structure that it should solder with
back electrode of the product. Thus, please be informed that the shape
of electrode pin of solder fillet formation is not guaranteed.
2.5
4-6. Reflow Profile
For reflow profile, please refer to the conditions below:(*)
• Meaning of marks, Conditions
Mark
Meanings
Conditions
Tsmax
Tsmin
Ts
TL
tL
TP
tP
ΔTR/Δt
ΔTD/Δt
Maximum of pre-heating temperature
180ºC
Minimum of pre-heating temperature
140ºC
Time from Tsmin to Tsmax
Reference temperature
Over 60sec.
230 to 250ºC
Retention time for TL
Peak temperature
Within 40sec.
250ºC(Max)
Time for peak temperature
Within 10sec.
Temperature rising rate
Under 3ºC/sec.
Temperature decreasing rate Over -3ºC/sec.
*Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces
before using, because stress from circuit boards and temperature variations of reflow furnaces vary by
customer’s own conditions.
4-7. Cleaning after Soldering
Please follow the conditions below if the cleaning is necessary after soldering.
Solvent
Temperature
Ultrasonic Cleaning
Drying
We recommend to use alcohols solvent such as, isopropyl alcohols
Under 30ºC within 3 minutes
15W / Below 1 liter (capacity of tank)
Under 100ºC within 3 minutes
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
7/7
2015.03 - Rev.B
7페이지 | |||
구 성 | 총 8 페이지수 | ||
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부품번호 | 상세설명 및 기능 | 제조사 |
CSL0701UT | LEDs | ROHM Semiconductor |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |