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부품번호 | SMBJ70CA 기능 |
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기능 | Transil | ||
제조업체 | STMicroelectronics | ||
로고 | |||
전체 10 페이지수
Features
■ Peak pulse power:
– 600 W (10/1000 μs)
– 4 kW (8/20 µs)
■ Stand off voltage range: from 5 V to 188 V
■ Unidirectional and bidirectional types
■ Low leakage current:
– 0.2 µA at 25 °C
– 1 µA at 85 °C
■ Operating Tj max: 150 °C
■ High power capability at Tj max:
– 515 W (10/1000 µs)
■ JEDEC registered package outline
Complies with the following standards
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-5
■ MIL STD 883G, method 3015-7 Class 3B:
– 25 kV HBM (human body model)
■ Resin meets UL 94, V0
■ MIL-STD-750, method 2026 soldererability
■ EIA STD RS-481 and IEC 60286-3 packing
■ IPC 7531 footprint
SMBJ
Transil™
A
K
Unidirectional
Bidirectional
SMB
(JEDEC DO-214AA)
Description
The SMBJ Transil series has been designed to
protect sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 600 W (10/1000 μs).
Planar technology makes these devices suitable
for high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
SMBJ are packaged in SMB (SMB footprint in
accordance with IPC 7531 standard).
October 2010
TM: Transil is a trademark of STMicroelectronics
Doc ID 5616 Rev 10
1/10
www.st.com
10
Characteristics
SMBJ
Figure 3.
Ppp (W)
700
600
Peak pulse power dissipation
versus initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
(Tj initial = 25 °C)
PPP(kW)
100.0
Tj initial = 25 °C
500
10.0
400
300
1.0
200
100
0
0
Tj(°C)
25 50 75 100 125 150 175
0.1
1.0E-03
1.0E-02
tP(ms)
1.0E-01
1.0E+00
1.0E+01
Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
1000.0
IPP(A )
Tj initial=25 °C
100.0
10.0
1.0
0.1
1
8/20 µs
10/1000 µs
10 ms
V CL(V)
10 100 1000
4/10 Doc ID 5616 Rev 10
4페이지 SMBJ
3 Package information
Package information
● Case: JEDEC DO-214AA molded plastic over planar junction
● Terminals: solder plated - solderable per MIL-STD-750, Method 2026
● Polarity: for unidirectional types the band indicates cathode
● Flammability: epoxy is rated UL94V-0
● RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMB dimensions
E1
Dimensions
Ref. Millimeters
Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
A1 D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
C A2
L
E1 4.05 4.60 0.159 0.181
b
L 0.75 1.50 0.030 0.059
Figure 13. Footprint dimensions
in mm (inches)
Figure 14. Marking layout(1)
1.62 2.60 1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.23)
Cathode bar ( unidirectional devices only )
e
xxx
z y ww
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
1. Marking layout can vary according to assembly location.
Doc ID 5616 Rev 10
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DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |