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PDF MGSF1N03L Data sheet ( Hoja de datos )
| Número de pieza | MGSF1N03L | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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MGSF1N03L, MVGSF1N03L
Power MOSFET
30 V, 2.1 A, Single N−Channel, SOT−23
These miniature surface mount MOSFETs low RDS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are dc−dc converters and power management in portable
and battery−powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
Features
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• AEC−Q101 Qualified and PPAP Capable − MVGSF1N03LT1
• These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value
Drain−to−Source Voltage
VDSS
30
Gate−to−Source Voltage
VGS ±20
Continuous Drain
Current RqJL
Steady TA = 25°C
State TA = 85°C
ID
2.1
1.5
Power Dissipation
RqJL
Steady TA = 25°C
State
PD
0.69
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
TA = 85°C
ID
1.6
1.2
Power Dissipation
(Note 1)
TA = 25°C
PD
0.42
Pulsed Drain Current
ESD Capability
(Note 3)
tp = 10 ms
C = 100 pF,
RS = 1500 W
IDM
ESD
6.0
125
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 sec)
TJ, TSTG
IS
TL
−55 to 150
2.1
260
Unit
V
V
A
W
A
W
A
V
°C
A
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Foot − Steady State
RqJL
180 °C/W
Junction−to−Ambient − Steady State (Note 1) RqJA
300
Junction−to−Ambient − t < 10 s (Note 1)
RqJA
250
Junction−to−Ambient − Steady State (Note 2) RqJA
400
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 650 mm2, 1 oz. Cu pad size.
2. Surface−mounted on FR4 board using 50 mm2, 1 oz. Cu pad size.
3. ESD Rating Information: HBM Class 0.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) TYP
80 mW @ 10 V
125 mW @ 4.5 V
N−Channel
D
ID MAX
2.1 A
G
S
MARKING DIAGRAM/
PIN ASSIGNMENT
3
Drain
1
SOT−23
N3 M G
G
CASE 318
STYLE 21
1
Gate
2
Source
N3 = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
MGSF1N03LT1G
MGSF1N03LT3G
MVGSF1N03LT1G
SOT−23
Pb−Free
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
3000 / Tape &
Reel
10000 / Tape &
Reel
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
September, 2012 − Rev. 10
1
Publication Order Number:
MGSF1N03LT1/D
1 page  
E
A
A1
MGSF1N03L, MVGSF1N03L
PACKAGE DIMENSIONS
D
3
12
e
HE
b
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
SEE VIEW C
c
0.25
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONMSI,LOLIRMGETATEERSBURRS.
INCHES
DIM MIN
NOM MAX
MIN NOM MAX
A 0.89 1.00 1.11 0.035 0.040 0.044
A1 0.01
0.06
0.10
0.001 0.002 0.004
b 0.37 0.44 0.50 0.015 0.018 0.020
c 0.09 0.13 0.18 0.003 0.005 0.007
D 2.80
2.90
3.04
0.110 0.114 0.120
E 1.20 1.30 1.40 0.047 0.051 0.055
e 1.78 1.90 2.04 0.070 0.075 0.081
L 0.10
0.20
0.30
0.004 0.008 0.012
L1 0.35
0.54
0.69
0.014 0.021 0.029
H E 2.10
2.40
2.64
0.083 0.094 0.104
q 0° −−− 10°
0° −−− 10°
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MGSF1N03LT1/D
5 Page | ||
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| PDF Descargar | [ Datasheet MGSF1N03L.PDF ] | |
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