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NUP4114 데이터시트 PDF




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광범위하게 사용되는 반도체 소자입니다.


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NUP4114 데이터시트, 핀배열, 회로
NUP4114 Series,
SZNUP4114 Series
Transient Voltage
Suppressors
ESD Protection Diodes with Low
Clamping Voltage
The NUP4114 transient voltage suppressors are designed to protect
high speed data lines from ESD. Ultra−low capacitance and high level
of ESD protection make these devices well suited for use in USB 2.0
high speed applications.
Features
Low Clamping Voltage
Small Body Outline Dimensions on SC−88 Package:
0.082x 0.078(2.10 mm x 1.25 mm)
Low Body Height: 0.043(1.10 mm)
Stand−off Voltage: 5.5 V
Low Leakage
Response Time is Typically < 1.0 ns
IEC61000−4−2 Level 4 ESD Protection
These Devices are Pb−Free and are RoHS Compliant
AEC−Q101 Qualified and PPAP Capable − SZNUP4114
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Typical Applications
LVDS
USB 2.0 High Speed Data Line and Power Line Protection
Digital Video Interface (DVI) and HDMI
Monitors and Flat Panel Displays
High Speed Communication Line Protection
Notebook Computers
Gigabit Ethernet
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −40 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 (ESD)
Contact
Air
±8 kV
±15
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
http://onsemi.com
5
16
34
2
MARKING
DIAGRAMS
6
SC−88
W1 SUFFIX
1 CASE 419B
X2 MG
G
1
6
SC−88
W1 SUFFIX
1 CASE 419B
X4 MG
G
1
6
TSOP−6
CASE 318G
1 STYLE 12
P4H MG
G
1
6
1
SOT−563
CASE 463A
P4MG
G
1
XXX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 3
1
Publication Order Number:
NUP4114/D




NUP4114 pdf, 반도체, 판매, 대치품
NUP4114 Series, SZNUP4114 Series
Figure 6. 500 MHz Data Pattern
ORDERING INFORMATION
Device
Marking
Package
Shipping
NUP4114UCLW1T2G
X2
SC−88
(Pb−Free)
3000 / Tape & Reel
NUP4114UCW1T2G
X4
SC−88
(Pb−Free)
3000 / Tape & Reel
NUP4114UPXV6T1G
P4
SOT−563
(Pb−Free)
4000 / Tape & Reel
NUP4114HMR6T1G
P4H
TSOP−6
(Pb−Free)
3000 / Tape & Reel
SZNUP4114UCLW1T2G
X2
SC−88
(Pb−Free)
3000 / Tape & Reel
SZNUP4114HMR6T1G
P4H
TSOP−6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4

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NUP4114 전자부품, 판매, 대치품
NUP4114 Series, SZNUP4114 Series
PACKAGE DIMENSIONS
D
65 4
ÉÉÉE1
ÉÉÉ1 2 3
NOTE 5
e
E
b
0.05
A1
A
TSOP−6
CASE 318G−02
ISSUE U
H
L2
GAUGE
PLANE
L
M
DETAIL Z
C
SEATING
PLANE
c
DETAIL Z
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b 0.25 0.38 0.50
c 0.10 0.18 0.26
D 2.90
3.00
3.10
E 2.50
2.75
3.00
E1 1.30
1.50
1.70
e 0.85 0.95 1.05
L 0.20 0.40 0.60
L2 0.25 BSC
M 0°
− 10°
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
3.20
6X
0.95
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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