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부품번호 | STPS3030 기능 |
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기능 | Low drop power Schottky rectifier | ||
제조업체 | STMicroelectronics | ||
로고 | |||
전체 9 페이지수
STPS3030/CT/CG/CR
Low drop power Schottky rectifier
Main product characteristics
IF(AV)
VRRM
Tj (max)
VF(max)
2 x 15 A
30 V
150° C
0.42 V
Features and benefits
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop for higher efficiency
■ Low thermal resistance
■ Avalanche capability specified
Description
Dual Schottky rectifier suited for switch mode
power supply and high frequency DC to DC
converters.
Packaged in TO-220AB, D2PAK and I2PAK, this
device is intended for use in low voltage high
frequency inverters, free-wheeling and polarity
protection applications.
A1
A2
K
K
A2
A1
D2PAK
STPS3030CG
A2
K
A1
TO-220AB
STPS3030CT
A2
K
A1
I2PAK
STPS3030CR
j
October 2006
Rev 4
1/9
www.st.com
9
Characteristics
STPS3030CT/CG/CR
Figure 7.
Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA)
1.E+03
Tj=150°C
1.E+02
Tj=125°C
Figure 8.
C(nF)
10.0
1.E+01
1.E+00
Tj=100°C
Tj=75°C
Tj=50°C
1.0
1.E-01
1.E-02
0
Tj=25°C
VR(V)
0.1
5 10 15 20 25 30
1
Junction capacitance versus
reverse voltage applied (typical
values)
F=1MHz
Vosc=30mV
Tj=25°C
VR(V)
10
100
Figure 9. Forward voltage drop versus
forward current
IFM(A)
100
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0
Figure 10.
Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm)
Rth(j-a)(°C/W)
80
70
D²PAK
60
50
40
30
20
10 S(cm²)
0
1.2 0 5 10 15 20 25 30 35 40
4/9
4페이지 STPS3030CT/CG/CR
Package information
Table 6. TO-220AB dimensions
Dimensions
Ref Millimeters
Inches
H2
Dia
L2
F2
F1
F
G1
G
L5
L6
L9
L4
A
C
L7
D
M
E
A
C
D
E
F
F1
F2
G
G1
H2
L2
L4
L5
L6
L7
L9
M
Diam
Min. Max.
4.40 4.60
1.23 1.32
2.40 2.72
0.49 0.70
0.61 0.88
1.14 1.70
1.14 1.70
4.95 5.15
2.40 2.70
10 10.40
16.4 typ.
13 14
2.65 2.95
15.25 15.75
6.20 6.60
3.50 3.93
2.6 typ.
3.75 3.85
Min. Max.
0.173 0.181
0.048 0.051
0.094 0.107
0.019 0.027
0.024 0.034
0.044 0.066
0.044 0.066
0.194 0.202
0.094 0.106
0.393 0.409
0.645 typ.
0.511 0.551
0.104 0.116
0.600 0.620
0.244 0.259
0.137 0.154
0.102 typ.
0.147 0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
7페이지 | |||
구 성 | 총 9 페이지수 | ||
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부품번호 | 상세설명 및 기능 | 제조사 |
STPS3030 | Low drop power Schottky rectifier | STMicroelectronics |
STPS3030CG | Low drop power Schottky rectifier | ST Microelectronics |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |