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PDF TSSP6038 Data sheet ( Hoja de datos )
| Número de pieza | TSSP6038 | |
| Descripción | IR Receiver Modules | |
| Fabricantes | Vishay | |
| Logotipo |  |
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TSSP6038
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
4
3
2
1
MECHANICAL DATA
Pinning
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
ORDERING CODE
Taping:
TSSP6038TT - top view taped
TSSP6038TR - side view taped
16797
FEATURES
• Low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Improved shielding against EMI
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
• Insensitive to supply voltage ripple and noise
• Taping available for top view and side view
assembly
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The TSSP6038 is a compact IR receiver for sensor
applications. It has a high gain for IR signals at 38 kHz. The
detection level does not change when ambient light or
strong IR signals are applied. It can receive continuous
38 kHz signals or 38 kHz bursts.
This component has not been qualified according to
automotive specifications.
PARTS TABLE
Carrier frequency 38 kHz
Package
Pinning
Dimensions (mm)
Mounting
Application
BLOCK DIAGRAM
33 kΩ
Input
AMP
Band
pass
Demo -
dulator
PIN
16839-4
3
VS
4
OUT
1
GND
TSSP6038
Panhead
1 = GND, 2 = N.C., 3 = VS, 4 = OUT
7.5 W x 5.3 H x 4.0 D
SMD
Presence sensors
APPLICATION CIRCUIT
17170-10
Transmitter
with
TSALxxxx
IR receiver
VS
OUT
GND
R1
C1
VO
+ VS
µC
GND
The external components R1 and C1 are optional
to improve the robustness against electrical overstress
(typical values are R1 = 100 Ω, C1 = 0.1 µF).
Rev. 1.2, 05-Feb-14
1 Document Number: 82483
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1 page  
www.vishay.com
TSSP6038
Vishay Semiconductors
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 20 s
max. 100 s
50 max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s
0
0
19800
50 100 150 200 250 300
t (s)
max. 2 cycles allowed
Rev. 1.2, 05-Feb-14
5 Document Number: 82483
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 Page 
www.vishay.com
SMD Tape and Reel
Vishay Semiconductors
Tape and Reel Standards for SMD IR Receiver Modules
Vishay Semiconductor SMD IR Receivers are packaged
on tape and reel. The following specification is based on
IEC publication 286, which takes the industrial requirements
for automatic insertion into account.
Absolute maximum ratings, mechanical dimensions, optical
and electrical characteristics for taped devices are identical
to the basic catalog types and can be found in the
specifications for untaped devices.
PACKAGING
The tapes of components are available on reels. Each reel is
marked with labels which contain the following information:
- Vishay
- Type
- Group
- Tape code, normally part of type name
- Production code
- Quantity
MISSING COMPONENTS
Up to 3 consecutive components may be missing if the gap
is followed by at least 6 components. A maximum of 0.5 %
of the components per reel quantity may be missing. At least
5 empty positions are present at the start and the end of the
tape to enable tape insertion.
Tensile strength of the tape: > 15 N
NUMBER OF COMPONENTS
A. Panhead SMD: quantity per reel:
TT, SMD top view package, 1190 pcs
TR, SMD side view package, 1120 pcs
B. Heimdall: quantity per reel:
TT, Heimdall top view package, 2200 pcs
TR, Heimdall side view package, 2300 pcs
C. Heimdall without lens: quantity per reel:
WTT, top view package, 2200 pcs
WTR, side view package, 2300 pcs
D. Bugeye: quantity per reel:
TT, 2500 pcs
TR, 2500 pcs
E. AP5: quantity per reel:
TT, 2500 pcs
TR, not available in side view
F. Belobog: quantity per reel:
TT1, 1800 pcs
TT2, 7000 pcs
TR, not available in side view
G. Belobog with shield: quantity per reel:
TT1, 1500 pcs
TT2, 5000 pcs
ORDER DESIGNATION
The type designation of the device is extended by
TT or TT1 for top view or TR for side view.
Example:
TSOP6238TR (reel packing)
TSOP75238TR (reel packing)
TSOP75338WTT (reel packing)
TSOP85438TT (reel packing)
TSOP85238AP5TR (reel packing)
TSOP57438TT1 (reel packing)
TSOP57238HTT1 (reel packing)
Rev. 2.1, 03-Dec-13
1 Document Number: 80125
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
11 Page | ||
| Páginas | Total 26 Páginas | |
| PDF Descargar | [ Datasheet TSSP6038.PDF ] | |
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