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SV1516FK 데이터시트 PDF




Dynex Semiconductor에서 제조한 전자 부품 SV1516FK은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 SV1516FK 자료 제공

부품번호 SV1516FK 기능
기능 Fast Recovery Diode
제조업체 Dynex Semiconductor
로고 Dynex Semiconductor 로고


SV1516FK 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.



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SV1516FK 데이터시트, 핀배열, 회로
Replaces March 1998 version, DS4209-2.2
SV15..F
SV15..F
Fast Recovery Diode
DS4209-3.0 January 2000
APPLICATIONS
s Induction Heating
s A.C. Motor Drives
s Snubber Diode
s Welding
s High Frequency Rectification
s UPS
FEATURES
s Thermal Fatigue Free Pressure Contact
s High Surge Capability
s Low Recovery Charge
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
Conditions
SV15 16F M or K
SV15 14F M or K
SV15 12F M or K
SV15 10F M or K
SV15 08F M or K
SV15 06F M or K
1600
1400
1200
1000
800
600
V = V + 100V
RSM
RRM
For 1/2" 20 UNF thread, add suffix K, e.g. SV15 16FK.
For M12 thread, add suffix M, e.g. SV15 16FM.
For stud anode add 'R' to type number, e.g. SV15 16FMR.
For outline DO8C add suffix 'C' to typ number,
e.g. SV15 16FKC.
KEY PARAMETERS
VRRM
I
F(AV)
IFSM
Qr
t
rr
1600V
205A
3000A
35µC
3.2µs
Outline type codes: DO8 and DO8C.
See Package Details for further information.
CURRENT RATINGS
Symbol
IF(AV)
IF(RMS)
Parameter
Mean forward current
RMS value
Conditions
Half wave resistive load, Tcase = 65oC
Tcase = 65oC
Max.
205
236
Units
A
A
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SV1516FK pdf, 반도체, 판매, 대치품
SV15..F
500
Measured under pulse conditions
400
300
200 Tj = 150˚C
100
Tj = 25˚C
0
1.0 1.2 1.4 1.6 1.8
Instantaneous forward voltage VF - (V)
Fig.2 Maximum (limit) forward characteristics
10000
1000
IF
50µs
QS = 0
tp = 1ms
dIR/dt
QS
IRR
Conditions:
Tj = 150˚C,
VR = 100V
IF = 200
IF = 2000
IF = 1000
IF = 500
100 IF = 100
10
1 10 100 1000
Rate of rise of reverse current dIR/dt - (A/µs)
Fig.3 Recovered charge
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SV1516FK 전자부품, 판매, 대치품
SV15..F
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Suite 410, 99 Bank Street,
Ottawa, Ontario, Canada K1P 6B9.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4209-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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Fast Recovery Diode

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