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PDF TLP3009S Data sheet ( Hoja de datos )
| Número de pieza | TLP3009S | |
| Descripción | GaAs IRED & PHOTO-TRIAC PHOTOCOUPLER | |
| Fabricantes | Toshiba Semiconductor | |
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TLP3009(S),TLP3010(S),TLP3011(S),TLP3012(S)
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC
TLP3009(S),TLP3010(S),TLP3011(S),TLP3012(S)
OFFICE MACHINE
HOUSEHOLD USE EQUIPMENT
TRIAC DRIVER
SOLID STATE RELAY
Unit: mm
The TOSHIBA TLP3009 (S), TLP3010 (S), TLP3011 (S) and TLP3012 (S)
consist of a photo-triac optically coupled to a gallium arsenide infrared
emitting diode in a six lead plastic DIP.
All parameters are tested to the specification of TLP3009, TLP3010,
TLP3011 and TLP3012.
l Peak Off-State Voltage : 250 V (min)
l Trigger LED Current
: 30 mA (max) (TLP3009)
15 mA (max) (TLP3010)
10 mA (max) (TLP3011)
5 mA (max) (TLP3012)
l On-State Current
: 100 mA (max)
l UL Recognized
: UL1577, File No. E67349
l Isolation Voltage
: 5000 Vrms (min)
l SEMKO Approved
: SS EN60065
SS EN60950
SS EN60335
l Option (D4) Type
VDE Approved
: DIN VDE0884 / 06.92
Certificate No. 68329
Maximum Operating Insulation Voltage : 890 Vpk
Highest Permissible Over Voltage
: 8000 Vpk
JEDEC
EIAJ
TOSHIBA
Weight: 0.39 g
―
―
11-7A9
PIN CONFIGURATION (Top view)
Note: When a VDE0884 approved type is needed, please
designate the ”Option (D4)”
1: ANODE
2: CATHODE
3: N.C.
4: TERMINAL 1
6: TERMINAL 2
Creepage Distance
Clearance
Insulation Thickness
7.62 mm pich
standard type
7.0 mm (min)
7.0 mm (min)
0.5 mm (min)
10.16 mm pich
(LF2) type
8.0 mm (min)
8.0 mm (min)
0.5 mm (min)
1 2001-05-11
1 page | ||
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| PDF Descargar | [ Datasheet TLP3009S.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| TLP3009 | GaAs IRED & PHOTO-TRIAC PHOTOCOUPLER | Toshiba Semiconductor |
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