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PDF ASMB-TTB0-0A3A2 Data sheet ( Hoja de datos )
| Número de pieza | ASMB-TTB0-0A3A2 | |
| Descripción | High Brightness Tall PLCC6 Tricolor Black Surface LED | |
| Fabricantes | Avago | |
| Logotipo |  |
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ASMB-TTB0-0A3A2
High Brightness Tall PLCC6 Tricolor Black Surface LED
Data Sheet
Description
This family of SMT LEDs packaged in the form of PLCC-6
with separate heat path for each LED dice, enabling it to
be driven at higher current.
For easy pick & place, the LEDs are shipped in tape and
reel. Every reel is shipped from a single intensity and color
bin; except red color for better uniformity.
These LEDs are compatible with reflow soldering process.
This super wide viewing angle at 115° together with the
built in reflector pushing up the intensity, the black top of
surface of the LED provides better contrast enhancement
makes these LED suitable to be used in full color signs ap-
plication.
Features
• Standard PLCC-6 package (Plastic Leaded Chip Carrier)
• LED package with diffused encapsulation
• Tall package enable potting on LED’s lead.
• High brightness using AlInGaP and InGaN dice
technologies
• Typical viewing angle at 115°
• Compatible with reflow soldering process
• JEDEC MSL 4
• Water resistance (IPx6* and IPx8) per IEC 60529:2001
- The test is conducted on component level by mounting
the components on PCB with potting to protect the
leads. It is strongly recommended that customers
perform necessary tests on the components for their final
application.
Applications
• Full color display
CAUTION: These LEDs are ESD-sensitive. Please observe appropriate precautions during
handlingandprocessing. PleaserefertoAvagoApplicationNoteAN-1142foradditionaldetails.
CAUTION: Customer is advised to keep the LED in the MBB when not in use, as prolonged exposure to
environment might cause the silver-plated leads to tarnish, which might cause difficulties in soldering.
1 page  
1.0
0.8
Blue
0.6
Green
Red
100
Red
Green/Blue
80
60
0.4 40
0.2 20
0.0400 450 500 550 600 650 700
RELATIVE INTENSITY
00 1 2 3
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current –mA vs Forward Voltage
4
5
3.0
Red
2.5 Green
Blue
2.0
1.5
1.0
0.5
3
Red
2 Green
Blue
1
0
-1
0.0
0 10 20 30 40
FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
50
-2
60 0 10 20 30 40 50
FORWARD CURRENT - mA
Figure 4. Dominant wavelength shift vs forward current
60
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-40
Blue
Red
Green
-20 0 20 40 60 80
TJ - JUNCTION TEMPERATURE
Figure 5. Relative Intensity vs Junction Temperature
100 120
0.4
0.3
0.2
0.1
0
-0.1 Blue
-0.2
Red
Green
-0.3-40 -20
0 20 40 60 80
TJ - JUNCTION TEMPERATURE
Figure 6. Forward Voltage vs Junction Temperature
100 120
5
5 Page 
PRECAUTIONARY NOTES
1. Handling precautions
a. Do not poke sharp objects into the encapsulant.
Sharp object like tweezers or syringes might
apply excessive force or even pierce through the
encapsulant and induce failures to the LED die or
wire bond.
b. Do not touch the encapsulant. Uncontrolled force
acting on the encapsulant might result in excessive
stress on the wire bond. The LED should only be
held by the body.
c. Do no stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
d. To remove foreign particles on the surface of
the encapsulant, a cotton bud can be used with
isopropyl alcohol (IPA). During cleaning, rub the
surface gently without applying too much pressure.
Ultrasonic cleaning is not recommended.
e. For automated pick and place, Avago has tested the
following nozzle size to be working fine with this
LED. However, due to the possibility of variations in
other parameters such as pick and place machine
maker/model and other settings of the machine,
customer is recommended to verify the nozzle
selected will not cause damage to the LED.
ID
OD
ID = 1.7mm
OD = 3.5mm
2. Handling of moisture sensitive device
This product has a Moisture Sensitive Level 4 rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
- An unopened moisture barrier bag (MBB) can
be stored at <40°C/90%RH for 12 months. If the
actual shelf life has exceeded 12 months and
the humidity Indicator Card (HIC) indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
- It is recommended that the MBB not be opened
prior to assembly (e.g. for IQC).
b. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 72 hours.
c. Control for unfinished reel
- Unused LEDs must be stored in a sealed MBB
with desiccant or desiccator at <5%RH.
d. Control of assembled boards
- If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB need to be stored in sealed MBB with
desiccant or desiccator at <5%RH to ensure that
all LEDs have not exceeded their floor life of 72
hours.
e. Baking is required if:
- The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
- The LEDs are exposed to condition of >30°C /
60% RH at any time.
- The LED floor life exceeded 72hrs.
The recommended baking condition is: 60±5ºC
for 24hrs
Baking should only be done once.
f. Storage
- The soldering terminals of these Avago LEDs
are silver plated. If the LEDs are being exposed
in ambient environment for too long, the silver
plating might be oxidized and thus affecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5%RH.
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ASMB-TTB0-0A3A2.PDF ] | |
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