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PDF LCA717STR Data sheet ( Hoja de datos )
| Número de pieza | LCA717STR | |
| Descripción | Single-Pole Normally Open OptoMOS Relay | |
| Fabricantes | IXYS | |
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
30
2
0.15
Units
VP
Arms / ADC
Features
• Very Low Maximum On-Resistance: 0.15
• High Load Current: 2A
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 6-Pin DIP Package
• Machine Insertable, Wave Solderable
• Surface Mount, Tape & Reel Version Available
Applications
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment: Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Pin Configuration
AC/DC Configuration
1
+ Control
2
– Control
3
Do Not Use
6
Load
5
Do Not Use
4
Load
DC Only Configuration
1
+ Control
2
– Control
3
Do Not Use
6
5
4
+ Load
– Load
LCA717
Single-Pole, Normally Open
OptoMOS® Relay
Description
The LCA717 is a 30V single-pole, normally open
(1-Form-A) Solid State Relay. It uses optically
coupled MOSFET technology to provide 3750Vrms
of input to output isolation, and features an ultra-low
on-resistance for high-current operation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Offering the superior reliability associated with
semiconductor devices, the LCA717 can be used to
replace mechanical relays. Because it has no moving
parts, it can offer faster, bounce-free switching in a
more compact surface mount or thru-hole package.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Ordering Information
Part #
LCA717
LCA717S
LCA717STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Switching Characteristics
of Normally Open Devices
Form-A
I
F
ILOAD
90%
ton
10%
toff
Pb
DS-LCA717-R04
e3
www.ixysic.com
1
1 page  
INTEGRATED CIRCUITS DIVISION
LCA717
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
LCA717 / LCA717S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
LCA717 / LCA717S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R04 www.ixysic.com
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| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet LCA717STR.PDF ] | |
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