CM1300 Datasheet PDF - California Micro Devices
| Part Number | CM1300 | |
| Description | 4 Channel EMI Filter Network | |
| Manufacturers | California Micro Devices | |
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There is a preview and CM1300 download ( pdf file ) link at the bottom of this page. Total 5 Pages | ||
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CM1300
4 Channel EMI Filter Network
Features
• Functionally and pin compatible with CSPRC032A
• OptiguardTM coated for improved reliability at
assembly
• 4 EMI filter lines per device
• Filters attenuate to –30dB at 3GHz
• CSP package minimizes cross-talk
• 9-bump 2.485mm X 0.985mm Chip Scale
Package (CSP), 0.5mm pitch
• 0.30mm Eutectic solder bumps
• Ultra small foot print suitable for portable devices
• Silicon substrate
• Lead-free version available
Applications
• EMI filtering for RF sections of wireless devices
• Cellular phones
• Cordless phones
• Internet appliances
• PDAs
• Laptop computers
Product Description
The CM1300 is a 4-channel low pass EMI filter (R-C-R
configuration) in a Chip Scale Package (CSP). Many
portable applications require the attenuation of signals
in the 800-3000 MHz band. California Micro Devices’
unique thin film technology provides a minimum of –
25dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected
such that the device can be placed directly on a FR4
printed circuit board using conventional assembly tech-
niques. The pin-out for the device features a signal
‘flow through’ design, allowing optimal signal routing.
The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/
Ag/Cu for lead-free finish) and are 0.30 mm in diame-
ter.
The CM1300 incorporates OptiguardTM coating which
results in improved reliability at assembly. The device is
available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.
Electrical Schematic
A1 50Ω
50Ω B1
R CR
43pF
GND
A2 50Ω
50Ω B2
R CR
43pF
GND
B3
GND
A4 50Ω
50Ω B4
R CR
43pF
GND
A5 50Ω
50Ω B5
R CR
43pF
GND
© 2003 California Micro Devices Corp. All rights reserved.
11/11/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
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CM1300
Mechanical Details
The CM1300 devices are packaged in custom Chip
Scale Packages (CSP).
CM1300 9-bump CSP Mechanical Specifications
The CM1300 devices are packaged in a 9-bump cus-
tom Chip Scale Package (CSP). Dimensions are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
9
Millimeters
Dim
Min Nom Max
Inches
Min Nom Max
A1 0.940 0.985 1.030 0.0370 0.0388 0.0406
A2 2.440 2.485 2.530 0.0961 0.0978 0.0996
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
C2 0.1925 0.2425 0.2925 0.0076 0.0095 0.0115
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape
and reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
OptiGuardTM
Coating
5
4
3
2 BA
1
BA
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
D1
D2
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1300 9-bump Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CM1300
PKG. SIZE (mm)
2.485 X 0.985 X 0.695
POCKET SIZE (mm)
B0 X A0 X K0
2.62 X 1.12 X 0.762
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
Top
Cover
Tape
Ko
Po
Ao
Bo
10 Pitches Cumulative
±To0l.e2ramnmce On Tape
W
QTY
PER
REEL
3500
P0 P1
4mm 4mm
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
11/11/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
5
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for CM1300 electronic component. |
| Information | Total 5 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ CM1300.PDF Datasheet ] | |
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