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부품번호 | AF122 기능 |
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기능 | ANTI-SULFURATED CHIP RESISTORS | ||
제조업체 | YAGEO | ||
로고 | |||
전체 8 페이지수
DATA SHEET
ANTI-SULFURATED CHIP RESISTORS
AF122 (4Pin/2R) / AF124 (8Pin/4R) /
AF164 (8Pin/ 4R)
5%, 1%
sizes 2 × 0402, 4 x 0402, 4 x 0603
RoHS compliant
Product specification 4
Chip Resistor Surface Mount AF SERIES 122/124/164 (RoHS Compliant)
8
SCHEMATIC
For dimension, please refer to Fig. 5 and Table 1
AF122
AF124/
164
Fig. 6 Equivalent circuit diagram
R1=R2=R3=R4
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
AF122
AF124
Operating Temperature Range
Rated Power
–55 °C to +125 °C
1/16 W
–55 °C to +155 °C
1/16 W
Maximum Working Voltage
50 V 25 V
Maximum Overload Voltage
100 V
50 V
Dielectric Withstanding Voltage
100 V
100 V
Resistance Range
5% (E24) 1 Ω to 1 MΩ
5% (E24)
1% (E24/E96) 10 Ω to 1 MΩ 1% (E24/E96)
Jumper < 50 mΩ
1 Ω to 1 MΩ
1 Ω to 1 MΩ
Jumper < 50 mΩ
Temperature Coefficient
1 Ω ≤ R < 10 Ω ±250 ppm/°C 1 Ω ≤ R < 10 Ω ±250 ppm/°C
10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C 10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C
Jumper Criteria
Rated Current
Maximum Current
0.5 A Rated Current
1.0 A Maximum Current
1.0 A
2.0 A
AF164
–55 °C to +155 °C
1/16W
50V
100V
100V
5%(E24)
1% (E24/E96)
1Ω to 1MΩ
1Ω to 1MΩ
Jumper <50 mΩ
±250 ppm/°C
Rated Current 1.0A
Maximum Current 2.0A
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please refer to data sheet
“Chip resistors mounting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PACKING STYLE
REEL DIMENSION
Paper Taping Reel (R)
7" (178 mm)
13" (330 mm)
AF122
10,000 units
50,000 units
AF124
10,000 units
40,000 units
NOTE
1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.
AF164
5,000 units
20,000 units
May 29, 2015 V.2
www.yageo.com
4페이지 Product specification 7
Chip Resistor Surface Mount AF SERIES 122/124/164 (RoHS Compliant)
8
TEST
Solderability
- Wetting
TEST METHOD
J-STD-002B test B
- Leaching
STD-002B test D
- Resistance to
Soldering Heat
IEC 60115-1 4.18
MIL-STD-202 Method 210
FOS ASTM-B-809-95
ASTM-B-809-95*
*Modified
PROCEDURE
REQUIREMENTS
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155
°C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (1%+0.05Ω)
<50 mΩ for Jumper
No visible damage
Sulfur (saturated vapor) 1000 hours,
90±2°C, unpowered.
± (1.0%+0.05Ω)
Sulfur 750 hours, 105℃, unpowered
± (4.0%+0.05Ω)
May 29, 2015 V.2
www.yageo.com
7페이지 | |||
구 성 | 총 8 페이지수 | ||
다운로드 | [ AF122.PDF 데이터시트 ] |
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DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |