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BLM18BB470SH1D 데이터시트, 핀배열, 회로
Reference Only
Spec. No. JENF243A-9101J-01
Chip Ferrite Bead BLM18□□□□□□H1D
Murata Standard Specification[AEC-Q200]
P.1/10
1.Scope
This specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_H Series based on AEC-Q200.
2.Part Numbering
(ex.) BL M 18 AG 121 S 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID
(4)Characteristics
(7)Category(for Automotive Electronics)
(2)Type
(5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×) (6)Performance
(9)Packaging (D:Taping)
3.Rating
Customer
Part Number

MURATA
Part Number
Impedance ()
(at 100MHz)(*1)
(refer to below comment)
BLM18PG300SH1D
BLM18PG330SH1D
BLM18PG600SH1D
BLM18PG121SH1D
BLM18PG181SH1D
BLM18PG221SH1D
BLM18PG331SH1D
BLM18PG471SH1D
BLM18SN220TH1D
BLM18KG260TH1D
BLM18KG300TH1D
BLM18KG700TH1D
BLM18KG101TH1D
BLM18KG121TH1D
BLM18KG221SH1D
BLM18KG331SH1D
BLM18KG471SH1D
BLM18KG601SH1D
BLM18AG121SH1D
BLM18AG151SH1D
BLM18AG221SH1D
BLM18AG331SH1D
BLM18AG471SH1D
BLM18AG601SH1D
BLM18AG102SH1D
BLM18BB050SH1D
BLM18BA050SH1D
BLM18BB100SH1D
BLM18BA100SH1D
BLM18BB220SH1D
BLM18BA220SH1D
BLM18BB470SH1D
BLM18BD470SH1D
BLM18BA470SH1D
20 min.
33±25%
40 min.
120±25%
180±25%
220±25%
330±25%
470±25%
22±7
26±25
30±25
70±25
100±25
120±25
220±25
330±25
470±25
600±25
120±25%
150±25%
220±25%
330±25%
470±25%
600±25%
1000±25%
5±25%
5±25%
10±25%
10±25%
22±25%
22±25%
47±25%
47±25
47±25%
Typical
30
33
60
120
180
220
330
470
22
26
30
70
100
120
220
330
470
600
120
150
220
330
470
600
1000
5
5
10
10
22
22
47
47
47
DC Resistance
Rated
Current
(mA)
(max.) (*1)
(refer to below
comment)
Initial Values
ESD Rank
2:2kV
6:25kV
Values After
at 85at 125
Testing
1000
3000*2 1000*2
0.05
0.025
0.10
0.050
500
2000*2 1000*2
1500*2 1000*2
1400*2 1000*2
1200*2 1000*2
0.1
0.05
0.09
0.10
0.15
0.2
0.10
0.18
0.14
0.20
6
1000
8000*2 5000*2
6000*2 2000*2
5000*2 2000*2
3500*2 1000*2
3000*2 1000*2
3000*2 1000*2
2200*2 1000*2
1700*2 1000*2
1500*2 1000*2
1300*2 1000*2
0.20
0.004
0.007
0.010
0.022
0.030
0.030
0.050
0.080
0.130
0.150
0.26
0.005
0.012
0.015
0.032
0.040
0.040
0.060
0.095
0.145
0.165
2
500 0.18 0.28
500 0.25 0.35
500 0.25 0.35
500
0.30 0.40
2
500 0.35 0.45
500 0.38 0.48
400 0.50 0.60
700 0.05 0.10
500 0.2 0.3
700 0.10 0.20
500 0.25 0.35
600
0.20 0.30
2
500 0.35 0.45
550 0.25 0.35
500 0.3 0.4
300 0.55 0.65
MURATA MFG.CO., LTD.




BLM18BB470SH1D pdf, 반도체, 판매, 대치품
Spec. No. JENF243A-9101J-01
Reference Only
P.4/10
No.
13
AEC-Q200
Stress
Test Method
Mechanical Shock
Per MIL-STD-202 Method 213
Condition F
1500g's (14.7N)/0.5ms/
Half sine
Murata Specification / Deviation
Meet Table C after testing.
Table C
Appearance
Impedance
Change
(at 100MHz)
DC Resistance
No damage
Within ±30%
Meet item 3.
14 Vibration
5g's(0.049N) for 20 minutes, Meet Table C after testing.
12cycles each of 3 orientations
Test from 10-2000Hz.
15 Resistance
Solder temperature
Pre-heating:150C +/-10 deg,60s to 90s
to Soldering Heat
260C+/-5 deg C
Meet Table A after testing.
Immersion time 10s
17 ESD
18 Solderability
Per AEC-Q200-002
Per J-STD-002
Meet Table C after testing.
ESD Rank: Meet Item 3. (Rating)
Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Measured : Impedance
Characterization
No defects
20 Flammability
Per UL-94
21 Board Flex
Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
22
Terminal Strength
Per AEC-Q200-006
Not Applicable
Meet Table A after testing.
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2
Not Applicable
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
2.0±0.05
4.0±0.1 4.0±0.1
1.5
+0.1
-0
1.05±0.1
Direction of feed
1B.1LMm1a8x_.SH1.1 max.
BLM18_TH0.85max.
(in mm)
MURATA MFG.CO., LTD.

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BLM18BB470SH1D 전자부품, 판매, 대치품
Spec. No. JENF243A-9101J-01
Reference Only
P.7/10
< For BLM18PG/KG/SN type >
Chip Ferrite Bead
Rated
Land pad thickness
Type Current a
b
c and dimension d
c d (A) 18µm 35µm 70µm
0.5 to1.5
Flow
0.7 0.7 0.7
a
BLM18PG 1.7 to2.5
Solder Resist BLM18KG 3to4
0.7
2.2 to 2.6
Reflow
0.7
1.2
2.4
0.7
1.2
0.7
0.7
1.8 to 2.0
b Pattern
5to6
6.4 3.3 1.65
BLM18SN 8
0.7 2.0
0.7 - 6.4 3.3
(in mm)
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3)soldering profile
Flow soldering profile
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min.
Time.(s)
Pre-heating
Heating
Cycle of flow
Standard Profile
150℃、60s min.
250℃、46s
2 times
Limit Profile
265℃±3℃、5s max.
2 times
MURATA MFG.CO., LTD.

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