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KIA2431BS 데이터시트 PDF




KEC에서 제조한 전자 부품 KIA2431BS은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 KIA2431BS 자료 제공

부품번호 KIA2431BS 기능
기능 BIPOLAR LINEAR INTEGRATED CIRCUIT
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KIA2431BS 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.



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KIA2431BS 데이터시트, 핀배열, 회로
SEMICONDUCTOR
TECHNICAL DATA
PROGRAMMABLE PRECISION REFERENCES
The KIA2431P/S/T/AP/AS/AT/BP/BS/BT are integrated
circuits are three-terminal programmable shunt regulator diodes.
These monolithic IC voltage reference operate as a low temperature
coefficient zener which is programmable from Vref to 16 volts with
two external resistors.
These devices exhibit a wide operating current range of 80 A
to 50mA with a typical dynamic impedance of 0.22 .
The characteristics of these references make them excellent
replacements for zener diodes in many applications such as
digital voltmeters, power supplies, and op amp circuitry.
FEATURES
Programmable Output Voltage to 16 Volts.
LINE UP
ITEM
P
KIA2431
S
T
AP
KIA2431 AS
AT
BP
* KIA2431 BS
BT
Package
TO-92
TSM
TSV
TO-92
TSM
TSV
TO-92
TSM
TSV
Note) * : Under development
Vref Tolerance (%)
1.5
1.0
0.5
Low Dynamic Output Impedance : 0.22 (Typ.).
Sink Current Capability of 80 A to 50mA.
Equivalent Full-Range Temperature Coefficient of 30ppm/
Temperature Compensated for Operation Over Full Rated
Operating Temperature Range.
Low Output Noise Voltage.
(Typ.).
Marking
Type No.
KIA2431T/S
KIA2431AT/AS
KIA2431BT/BS
Marking
24A
24B
24C
KIA2431P/S/T/AP/AS
AT/BP/BS/BT
BIPOLAR LINEAR INTEGRATED CIRCUIT
BC
E
K
G
D
H
FF
1 23
N
DIM MILLIMETERS
A 4.70 MAX
B 4.80 MAX
C 3.70 MAX
D 0.45
E 1.00
F 1.27
G 0.85
H 0.45
J 14.00 +_0.50
K 0.55 MAX
L 2.30
M 0.45 MAX
N 1.00
1. REFERENCE
2. ANODE
3. CATHODE
TO-92
E
K BK
2
3
1
DIM
A
B
C
D
E
F
G
H
I
J
K
L
MILLIMETERS
2.9 +_ 0.2
1.6+0.2/-0.1
0.70+_ 0.05
0.4+_ 0.1
2.8+0.2/-0.3
1.9+_ 0.2
0.95
0.16+_ 0.05
0.00-0.10
0.25+0.25/-0.15
0.60
0.55
H
JJ
1. CATHODE
2. REFERENCE
3. ANODE
2
3
1
TSM
E
K BK
15
2
34
DIM
A
B
C
D
E
F
G
H
I
J
K
L
MILLIMETERS
2.9 +_ 0.2
1.6+0.2/-0.1
0.70 +_ 0.05
0.4 +_ 0.1
2.8+0.2/-0.3
1.9 +_ 0.2
0.95
0.16 +_ 0.05
0.00-0.10
0.25+0.25/-0.15
0.60
0.55
H
JJ
1. N.C
2. N.C
3. CATHODE
4. REFERENCE
5. ANODE
15
2
34
TSV
2007. 8. 14
Revision No : 3
1/7




KIA2431BS pdf, 반도체, 판매, 대치품
KIA2431P/S/T/AP/AS/AT/BP/BS/BT
Vref - Tj
1.248
1.246
IK =10mA
1.244
1.242
1.240
1.238
1.236
1.234
-40 -20 0 20 40 60 80 100
JUNCTION TEMPERATURE Tj ( C)
IK - VKA (1)
30 VKA = Vref
Ta=25 C
20
10
0
-10
-20
-30
-1 -0.5 0 0.5 1
CATHODE VOLTAGE VKA (V)
1.5
40
VKA =16V
Vref =0
30
Ioff - Tj
20
10
0
-50 -25 0 25 50 75 100 125 150
JUNCTION TEMPERATURE Tj ( C)
2007. 8. 14
Revision No : 3
Iref - Tj
200
IK =10mA
R1 =10K
R2 =OPEN
150
100
50
0
-50 -25 0 25 50 75 100 125 150
JUNCTION TEMPERATURE Tj ( C)
IK - VKA (2)
250
200
VKA = Vref
Ta=25 C
150
100
50
0
-50
-100
-150
-200
-250
-1 -0.5 0 0.5 1
CATHODE VOLTAGE VKA (V)
1.5
Vref - Tj
0
IK =10mA
-0.1 VKA =Vref TO 16V
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-50 -25 0 25 50 75 100 125 150
JUNCTION TEMPERATURE Tj ( C)
4/7

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KIA2431BS 전자부품, 판매, 대치품
KIA2431P/S/T/AP/AS/AT/BP/BS/BT
PRECAUTION FOR USE
SOLDERING
Flat Package (TSM/TSV Package)
Elements mounting styles of electronic devices are gaining in further diversification over recent
years, and needs for components are all the more expanding in varieties. Especially, surface mounting
is steadily penetrating into industrial segments as a world-wide popular technical trend.
Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering
temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability.
240
210
150
60 sec.
Time (sec.)
Within 10 sec.
Within 30 sec.
Fig. 6
(a) When employing solder reflow method
Atmospheric temperature around resin surfaces must be less than 240 , not exceeding the time length of 10 sec.
Recommend temperature profile
Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
(b) When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause
extensive localized temperature rise.
Please keep a reflow solder operating when TSM/TSV packages soldering.
2007. 8. 14
Revision No : 3
7/7

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