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PDF QM2607C1 Data sheet ( Hoja de datos )

Número de pieza QM2607C1
Descripción N-Ch and P-Ch Fast Switching MOSFETs
Fabricantes UBIQ 
Logotipo UBIQ Logotipo



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QM2607C1
N-Ch and P-Ch Fast Switching MOSFETs
General Description
The QM2607C1 is the highest performance trench
N-ch and P-ch MOSFETs with extreme high cell
density , which provide excellent RDSON and gate
charge for most of the small power switching and
load switch applications.
The QM2607C1 meet the RoHS and Green
Product requirement with full function reliability
approved.
Features
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent Cdv/dt effect decline
z Green Device Available
Product Summery
BVDSS
20V
-20V
RDSON
115m
255m
ID
1.3 A
-0.94 A
Applications
z High Frequency Point-of-Load Synchronous s
Small power switching for MB/NB/UMPC/VGA
z Networking DC-DC Power System
z Load Switch
SOT363 (SC-70-6L ) Pin Configuration
Absolute Maximum Ratings
Symbol
VDS
VGS
ID@TA=25
ID@TA=70
IDM
PD@TA=25
TSTG
TJ
Thermal Data
Symbol
RθJA
RθJC
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS @ 4.5V1
Continuous Drain Current, VGS @ 4.5V1
Pulsed Drain Current2
Total Power Dissipation3
Storage Temperature Range
Operating Junction Temperature Range
Parameter
Thermal Resistance Junction-ambient 1
Thermal Resistance Junction-Case1
1
Rating
N-Channel P-Channel
20 -20
±8 ±8
1.3 -0.94
1 -0.75
6.5 -4.7
0.33 0.33
-55 to 150 -55 to 150
-55 to 150 -55 to 150
Units
V
V
A
A
A
W
Typ.
---
---
Max.
375
240
Unit
/W
/W
Rev A.02 D081011

1 page




QM2607C1 pdf
QM2607C1
N-Ch and P-Ch Fast Switching MOSFETs
P-Channel Electrical Characteristics (TJ=25 , unless otherwise noted)
Symbol
Parameter
BVDSS Drain-Source Breakdown Voltage
BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON) Static Drain-Source On-Resistance2
VGS(th)
VGS(th)
IDSS
IGSS
gfs
Qg
Qgs
Qgd
Td(on)
Tr
Td(off)
Tf
Ciss
Coss
Crss
Gate Threshold Voltage
VGS(th) Temperature Coefficient
Drain-Source Leakage Current
Gate-Source Leakage Current
Forward Transconductance
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Conditions
VGS=0V , ID=-250uA
Reference to 25, ID=-1mA
VGS=-4.5V , ID=-1A
VGS=-2.5V , ID=-0.8A
VGS=-1.8V , ID=-0.5A
VGS=VDS , ID =-250uA
VDS=-16V , VGS=0V , TJ=25
VDS=-16V , VGS=0V , TJ=55
VGS=±8V , VDS=0V
VDS=-5V , ID=-1.5A
VDS=-20V , VGS=-4.5V , ID=-1.5A
VDD=-12V , VGS=-4.5V , RG=3.3Ω
ID=-1A
VDS=-15V , VGS=0V , f=1MHz
Min.
-20
---
---
---
-0.3
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
Typ.
---
-0.011
205
255
315
-0.5
2.02
---
---
---
4
4.6
0.27
2.34
11.6
6.2
31.8
2.8
194
35.5
28.2
Max.
---
---
255
320
395
-1
---
-1
-5
±100
---
---
---
---
---
---
---
---
---
---
---
Unit
V
V/
mΩ
V
mV/
uA
nA
S
nC
ns
pF
Diode Characteristics
Symbol
IS
ISM
VSD
Parameter
Continuous Source Current1,4
Pulsed Source Current2,4
Diode Forward Voltage2
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25
Min.
---
---
---
Typ.
---
---
---
Max.
-0.94
-4.7
-1
Unit
A
A
V
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width 300us , duty cycle 2%
3.The power dissipation is limited by 150junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
5

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