R5F51303AGFM PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 R5F51303AGFM
기능 32-bit RX MCUs
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R5F51303AGFM 데이터시트, 핀배열, 회로
RX130 Group
Renesas MCUs
32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory,
Oct 30, 2015
up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC,
IEC60730 compliance, 1.8-V to 5.5-V single supply
32-bit RX CPU core
Max. operating frequency: 32 MHz
Capable of 50 DMIPS in operation at 32 MHz
Accumulator handles 64-bit results (for a single instruction) from
32-bit × 32-bit operations
Multiplication and division unit handles 32-bit × 32-bit operations
(multiplication instructions take one CPU clock cycle)
Fast interrupt
CISC Harvard architecture with 5-stage pipeline
Variable-length instructions, ultra-compact code
On-chip debugging circuit
Low power design and architecture
Operation from a single 1.8-V to 5.5-V supply
Three low power consumption modes
Low power timer (LPT) that operates during the software standby state
Supply current
High-speed operating mode: 96 A/MHz
Supply current in software standby mode: 0.37 A
Recovery time from software standby mode: 4.8 s
On-chip flash memory for code, no wait states
Operation at 32 MHz, read cycle of 31.25 ns
No wait states for reading at full CPU speed
Programmable at 1.8 V
For instructions and operands
On-chip data flash memory
8 Kbytes (1,000,000 program/erase cycles (typ.))
BGO (Background Operation)
On-chip SRAM, no wait states
10- to 16-Kbyte size capacities
Four transfer modes
Transfer can be set for each interrupt source.
Module operation can be initiated by event signals without using
Linked operation between modules is possible while the CPU is sleeping.
Reset and supply management
Eight types of reset, including the power-on reset (POR)
Low voltage detection (LVD) with voltage settings
Clock functions
External clock input frequency: Up to 20 MHz
Main clock oscillator frequency: 1 to 20 MHz
Sub clock oscillator frequency: 32.768 kHz
PLL circuit input: 4 MHz to 8 MHz
Low-speed on-chip oscillator: 4 MHz
High-speed on-chip oscillator: 32 MHz ± 1 %
IWDT-dedicated on-chip oscillator: 15 kHz
Generate a 32.768 kHz clock for the real-time clock
On-chip clock frequency accuracy measurement circuit (CAC)
Realtime clock
Adjustment functions (30 seconds, leap year, and error)
Calendar count mode or binary count mode selectable
Independent watchdog timer
15-kHz on-chip oscillator produces a dedicated clock signal to drive
IWDT operation.
Useful functions for IEC60730 compliance
Self-diagnostic and disconnection-detection assistance functions for
the A/D converter, clock frequency accuracy measurement circuit,
independent watchdog timer, RAM test assistance functions using the
DOC, etc.
PLQP0080KB-B 12 × 12mm, 0.5mm pitch
PLQP0064GA-A 14 × 14mm, 0.8mm pitch
PLQP0064KB-C 10 × 10mm, 0.5mm pitch
PLQP0048KB-B 7 × 7mm, 0.5mm pitch
PWQN0048KB-A 7 × 7mm, 0.5mm pitch
Input/output functions selectable from multiple pins
Up to 6 communication functions
SCI with many useful functions (up to 4 channels)
Asynchronous mode (Fine adjustable baud rate: 0 to 255/255), clock
synchronous mode, smart card interface mode
I2C bus interface: Transfer at up to 400 kbps, capable of SMBus
operation (one channel)
RSPI (one channel): Transfer at up to 16 Mbps
Up to 12 extended-function timersMPC
16-bit MTU: input capture, output compare, complementary PWM
output, phase counting mode (six channels)
8-bit TMR (four channels)
16-bit compare-match timers (two channels)
12-bit A/D converter
Capable of conversion within 1.4 μs
17 channels
Sampling time can be set for each channel
Conversion results compare features
Self-diagnostic function and analog input disconnection detection
assistance function
Double trigger (data duplication) function for motor control
D/A converter
Two channels
Capacitive touch sensing unit
Self-capacitance method: A single pin configures a single key,
supporting up to 36 keys
Mutual capacitance method: Matrix configuration with 36pins, supporting
up to 324 keys
Comparator B
Two channels
General I/O ports
5-V tolerant, open drain, input pull-up, switching of driving capacity
Temperature sensor
Unique ID
32-byte ID code for the MCU
Operating temperature range
 40 to +85C
 40 to +105C
General industrial and consumer equipment
R01DS0273EJ0100 Rev.1.00
Oct 30, 2015
Page 1 of 116
R5F51303AGFM pdf, 반도체, 판매, 대치품
RX130 Group
1. Overview
Table 1.1
Outline of Specifications (3/3)
Serial peripheral interface
12-bit A/D converter (S12ADE)
Temperature sensor (TEMPSA)
D/A converter (DA)
CRC calculator (CRC)
Comparator B (CMPBa)
Capacitive touch sensing unit (CTSUa)
Data operation circuit (DOC)
Unique ID
Power supply voltages/Operating frequencies
Supply current
Operating temperature range
On-chip debugging system
1 channel
Transfer facility
Using the MOSI (master out, slave in), MISO (master in, slave out), SSL (slave select), and RSPCK
(RSPI clock) signals enables serial transfer through SPI operation (four lines) or
clock-synchronous operation (three lines)
Capable of handling serial transfer as a master or slave
Data formats
Choice of LSB-first or MSB-first transfer
The number of bits in each transfer can be changed to 8, 9, 10, 11, 12, 13, 14, 15, 16, 20, 24, or
32 bits.
128-bit buffers for transmission and reception
Up to four frames can be transmitted or received in a single transfer operation (with each frame
having up to 32 bits)
Double buffers for both transmission and reception
12 bits (17 channels × 1 unit)
12-bit resolution
Minimum conversion time: 1.4 µs per channel when the ADCLK is operating at 32 MHz
Operating modes
Scan mode (single scan mode, continuous scan mode, and group scan mode)
Group A priority control (only for group scan mode)
Sampling variable
Sampling time can be set up for each channel.
Self-diagnostic function
Double trigger mode (A/D conversion data duplicated)
Detection of analog input disconnection
Conversion results compare features
A/D conversion start conditions
A software trigger, a trigger from a timer (MTU), an external trigger signal, or ELC
Event linking by the ELC
1 channel
The voltage output from the temperature sensor is converted into a digital value by the 12-bit A/D
2 channels
8-bit resolution
Output voltage: 0V to AVCC0
CRC code generation for arbitrary amounts of data in 8-bit units
Select any of three generating polynomials:
X8 + X2 + X + 1, X16 + X15 + X2 + 1, or X16 + X12 + X5 + 1
Generation of CRC codes for use with LSB-first or MSB-first communications is selectable.
2 channels
Function to compare the reference voltage and the analog input voltage
Window comparator operation or standard comparator operation is selectable
Detection pin: 36 channels
Comparison, addition, and subtraction of 16-bit data
32-byte ID code for the MCU
VCC = 1.8 to 2.4 V: 8 MHz, VCC = 2.4 to 2.7 V: 16 MHz, VCC = 2.7 to 5.5 V: 32 MHz
D version: 40 to +85°C, G version: 40 to +105°C
80-pin LFQFP (PLQP0080KB-B) 12 × 12 mm, 0.5 mm pitch
64-pin LFQFP (PLQP0064KB-C) 10 × 10 mm, 0.5 mm pitch
64-pin LQFP (PLQP0064GA-A) 14 × 14 mm, 0.8 mm pitch
48-pin LFQFP (PLQP0048KB-B) 7 × 7 mm, 0.5 mm pitch
48-pin HWQFN (PWQN0048KB-A) 7 × 7 mm, 0.5 mm pitch
E1 emulator (FINE interface)
R01DS0273EJ0100 Rev.1.00
Oct 30, 2015
Page 4 of 116


R5F51303AGFM 전자부품, 판매, 대치품
RX130 Group
1. Overview
R5 F 5 1 3 0 5 A D F M
Package type, number of pins, and pin pitch
FN: LFQFP/80/0.50
FM: LFQFP/64/0.50
FK: LQFP/64/0.80
FL: LFQFP/48/0.50
NE: HWQFN/48/0.50
D: Operating ambient temperature (–40°C to +85°C)
G: Operating ambient temperature (–40°C to +105°C)
ROM, RAM, and E2 DataFlash capacity
5: 128 Kbytes/16 Kbytes/8 Kbytes
3: 64 Kbytes/10 Kbytes/8 Kbytes
Group name
30: RX130 Group
Series name
RX100 Series
Type of memory
F: Flash memory version
Renesas MCU
Renesas semiconductor product
Figure 1.1
How to Read the Product Part Number
R01DS0273EJ0100 Rev.1.00
Oct 30, 2015
Page 7 of 116


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