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PDF SN74LS541 Data sheet ( Hoja de datos )

Número de pieza SN74LS541
Descripción Octal Buffer/Line Driver
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No Preview Available ! SN74LS541 Hoja de datos, Descripción, Manual

SN74LS541
Octal Buffer/Line Driver
with 3−State Outputs
The SN74LS541 is an octal buffer and line driver with the same
functions as the LS241, but with pinouts on the opposite side of the
package.
This device type is designed to be used as a memory address driver,
clock driver and bus-oriented transmitter / receiver. This device is
especially useful as output ports for the microprocessors, allowing
ease of layout and greater PC board density.
Hysteresis at Inputs to Improve Noise Margin
PNP Inputs Reduce Loading
3-State Outputs Drive Bus Lines
Inputs and Outputs Opposite Side of Package, Allowing Easier
Interface to Microprocessors
Input Clamp Diodes Limit High-Speed Termination Effects
LOGIC AND CONNECTION DIAGRAM DIP (TOP VIEW)
VCC
20 19 18 17 16 15 14 13 12 11
20
1
http://onsemi.com
LOW
POWER
SCHOTTKY
MARKING
DIAGRAMS
SN74LS541N
AWLYYWW
PDIP20
N SUFFIX
CASE 738
1
1 2 3 4 5 6 7 8 9 10
GND
GUARANTEED OPERATING RANGES
Symbol
Parameter
Min Typ Max Unit
VCC Supply Voltage
TA Operating Ambient
Temperature Range
4.75 5.0 5.25
V
0 25 70 °C
IOH Output Current High
IOL Output Current Low
15 mA
24 mA
© Semiconductor Components Industries, LLC, 2006
July, 2006 Rev. 4
1
20
1
SOIC20
DW SUFFIX
LS541
AWLYYWW
CASE 751D
1
74LS541
AWLYWW
20 SOEIAJ20
1 M SUFFIX 1
CASE 967
A = Assembly Location
WL = Wafer Lot
Y, YY = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping
SN74LS541N
PDIP20 1440 Units/Box
SN74LS541DW SOICWIDE 38 Units/Rail
SN74LS541DWR2 SOICWIDE 2500/Tape & Reel
SN74LS541M
SOEIAJ20 See Note 1
SN74LS541MEL SOEIAJ20 See Note 1
1. For ordering information on the EIAJ version of
the SOIC package, please contact your local
ON Semiconductor representative.
Publication Order Number:
SN74LS541/D

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SN74LS541 pdf
SN74LS541
PACKAGE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D05
ISSUE F
DA
q
20 11
E
1 10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
A1
PLANE
T
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0_ 7_
http://onsemi.com
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