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PDF NCP2815 Data sheet ( Hoja de datos )
| Número de pieza | NCP2815 | |
| Descripción | LongPlay Headphone Amplifier | |
| Fabricantes | ON Semiconductor | |
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NCP2815
NOCAPt LongPlay
Headphone Amplifier
NCP2815 is a dual LongPlay true ground headphone amplifier
designed for portable communication device applications such as
mobile phones. This part is capable of delivering 26 mW of
continuous average power into a 32 W load from a 1.8 V power supply
with a THD+N of 1%.
Based on the power supply delivered to the device, an internal
power management block generates a symmetrical positive and
negative voltage. Thus, the internal amplifiers provide outputs
referenced to Ground and the losses are reduced which helps to
increase the battery life. In this NOCAP configuration, the two
external heavy coupling capacitors can be removed. This provides a
significant space and cost savings compared to a typical stereo
application.
NCP2815 is available with an external adjustable gain (version A),
or internal gain of −1.5 V/V (version B). It reaches a superior −100 dB
PSRR and noise floor. Thus, it offers high fidelity audio sound, as well
as a direct connection to the battery. It contains circuitry to prevent
“Pop & Click” noise that would otherwise occur during turn−on and
turn−off transitions. The device is available in 12 bump CSP package
(1.2 x 1.6 mm) which helps to save space on the board.
Features
• NOCAP Output Eliminates DC−Blocking Capacitors:
♦ Saves Board Area
♦ Saves Component Cost
♦ No Low−Frequency Response Attenuation
• LongPlay Architecture: Increase the Battery Life
• High PSRR (−100 dB): Direct Connection to the Battery
• “Pop and Click” Noise Protection Circuitry
• Internal Gain (−1.5 V/V) or External Adjustable Gain
• Ultra Low Current Shutdown Mode
• High Impedance Mode
• 1.6 V – 3.6 V Operation
• Thermal Overload Protection Circuitry
• CSP 1.2 x 1.6 mm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Headset Audio Amplifier for
♦ Cellular Phones
♦ MP3 player
♦ Personal Digital Assistant and Portable Media Player
♦ Portable Devices
http://onsemi.com
12 PIN CSP
FC SUFFIX
CASE 499BJ
MARKING
DIAGRAM
815xz
AYWW
G
x = A for NCP2815A
= B for NCP2815B
z = C for Backside laminate
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
Pin Configuration
A1
CPM
B1
PGND
C1
CPP
A2 A3
PVM
B2
INL
B3
/SD HiZ
C2 C3
VP OUTL
(Top View)
A4
INR
B4
SGND
C4
OUTR
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 1
1
Publication Order Number:
NCP2815/D
1 page  
NCP2815
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VP Pin: Power Supply Voltage (Note 1)
INL, INR, /SD pins
HiZ, OUTL, OUTR pins
Human Body Model (HBM) ESD Rating are (Note 2)
VIN
Vmr1
Vmr2
ESD HBM
−0.3 to + 4.5
−0.3 to VP + 0.3
−0.3 – VP to VP + 0.3
2000
V
V
V
V
Machine Model (MM) ESD Rating are (Note 2)
ESD MM 200 V
CSP 1.2 x 1.6 mm package (Notes 6 and 7)
Thermal Resistance Junction to Case
RqJC
(Note 7)
°C/W
Operating Ambient Temperature Range
TA
−40 to + 85
°C
Operating Junction Temperature Range
TJ
−40 to + 125
°C
Maximum Junction Temperature (Note 6)
TJMAX
+ 150
°C
Storage Temperature Range
TSTG
−65 to + 150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25 °C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation.
7.
oTuhtepuRtqcCuArrisendteapnedndtheentsoenletchteedPCexBtehrenaatl
dissipation. The
components.
maximum
power
dissipation
(PD)
is
dependent
on
the
min
input
voltage,
the
max
RqCA
+
125 *
PD
TA
*
RqJC
http://onsemi.com
5
5 Page 
NCP2815
PACKAGE DIMENSIONS
12 PIN FLIP−CHIP, 1.62x1.22, 0.4P
CASE 499BJ
ISSUE A
PIN A1
REFERENCE
D AB
2X
0.10 C
E
2X 0.10 C
TOP VIEW
0.10 C
A
A2
A1
12X 0.05 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
12X b
0.05 C A B
0.03 C
e/2
e
C
B
A
1234
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.56
A1 0.17 0.23
A2 0.33 0.39
b 0.24 0.29
D 1.62 BSC
E 1.22 BSC
e 0.40 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
0.40
PITCH
A1
12X
0.26
0.40
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOCAP is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
11
NCP2815/D
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet NCP2815.PDF ] | |
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