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PDF MBRS4201P Data sheet ( Hoja de datos )

Número de pieza MBRS4201P
Descripción Schottky Fast Soft-Recovery Power Rectifier
Fabricantes ON Semiconductor 
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MBRS4201P
200 V, 4 A Schottky
Fast Soft-Recovery
Power Rectifier
SMC Power Surface Mount Package
Features
Lower Forward Voltage than any Ultrafast Rectifier:
VF < 0.61 V at 150°C
Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns
Soft Recovery Characteristics: Softness Factor (tb/ta) 1
Highly Stable Over Temperature
These are Pb-Free Packages
Benefits
Significantly Reduced EMI
Eliminates the Need of Snubber Circuits
Low Switching and Heat Losses
Improved Thermal Management
Applications
Engine and Convenience Control Systems
Motor Controls
Battery Chargers and Switching Power Supplies
Mechanical Characteristics
Small Compact Surface Mount Package with J–Bend Leads
Rectangular Package for Automated Handling
Weight: 217 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
ESD Ratings:
Machine Model = A
Human Body Model = 1C
Cathode Polarity Band
www.onsemi.com
SCHOTTKY RECTIFIER
4 AMPS, 200 VOLTS
SMC
CASE 403AC
MARKING DIAGRAM
AYWW
B421G
G
B421
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBRS4201PT3G
Package
SMC
(Pb−Free)
Shipping
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 0
1
Publication Order Number:
MBRS4201P/D

1 page




MBRS4201P pdf
MBRS4201P
PACKAGE DIMENSIONS
SMC 2−LEAD
CASE 403AC
ISSUE O
E
E1
D
TOP VIEW
DETAIL A
A1 c
DETAIL A
A
L
SIDE VIEW
b
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH.
MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE.
4. DIMENSIONS D AND E1 TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DE­
TERMINED BY DIMENSION L.
MILLIMETERS
DIM MIN
MAX
A 1.95
2.65
A1 0.05
0.20
b 2.90
3.20
c 0.15 0.41
D 5.55
6.25
E 7.75
E1 6.60
8.15
7.15
L 0.75
1.60
RECOMMENDED
SOLDERING FOOTPRINT*
8.75
2X 3.79
2X 2.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
5
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