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ESD7205 데이터시트 PDF




ON Semiconductor에서 제조한 전자 부품 ESD7205은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 ESD7205 기능
기능 ESD Protection Diodes
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ESD7205 데이터시트, 핀배열, 회로
ESD7205, SZESD7205
Product Preview
ESD Protection Diodes
Low Capacitance ESD Protection Diodes
for High Speed Data Line
The ESD7205 transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines. The small form factor,
flow−through style package allows for easy PCB layout and matched
trace lengths necessary to maintain consistent impedance between
high speed differential lines such as Ethernet and LVDS present in
automotive camera modules.
Features
Low Capacitance (0.4 pF Typical, I/O to GND)
Diode capacitance matching
Protection for the Following IEC Standards:
IEC 61000−4−2 Level 4 (ESD)
Low ESD Clamping Voltage (12 V Typical, +16 A TLP, I/O to GND)
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
10/100/1000 Automotive Ethernet
LVDS
Automotive USB 2.0
High Speed Differential Pairs
www.onsemi.com
MARKING
DIAGRAMS
SOT−723
CASE 631AA
XX M
1
XX = Specific Device Code
M = Date Code
SC−70
CASE 419
XXMG
G
1
XX = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
Pin 1 Pin 2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −55 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ISO 10605 330 pF / 2 kW Contact
ISO 10605 330 pF / 330 W Contact
ESD
±25 kV
±25
±30
±20
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
Pin 3
=
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2015
September, 2015 − Rev. P2
1
Publication Order Number:
ESD7205/D




ESD7205 pdf, 반도체, 판매, 대치품
ESD7205, SZESD7205
IEC 61000−4−2 Spec.
Level
First Peak
Test Volt- Current Current at
age (kV)
(A) 30 ns (A)
1 2 7.5 4
2 4 15 8
3 6 22.5 12
48
30 16
Current at
60 ns (A)
2
4
6
8
IEC61000−4−2 Waveform
Ipeak
100%
90%
I @ 30 ns
I @ 60 ns
10%
Figure 5. IEC61000−4−2 Spec
tP = 0.7 ns to 1 ns
ESD Gun
TVS
Oscilloscope
50 W
Cable
50 W
Figure 6. Diagram of ESD Clamping Voltage Test Setup
The following is taken from Application Note
AND8308/D − Interpretation of Datasheet Parameters
for ESD Devices.
ESD Voltage Clamping
For sensitive circuit elements it is important to limit the
voltage that an IC will be exposed to during an ESD event
to as low a voltage as possible. The ESD clamping voltage
is the voltage drop across the ESD protection diode during
an ESD event per the IEC61000−4−2 waveform. Since the
IEC61000−4−2 was written as a pass/fail spec for larger
systems such as cell phones or laptop computers it is not
clearly defined in the spec how to specify a clamping voltage
at the device level. ON Semiconductor has developed a way
to examine the entire voltage waveform across the ESD
protection diode over the time domain of an ESD pulse in the
form of an oscilloscope screenshot, which can be found on
the datasheets for all ESD protection diodes. For more
information on how ON Semiconductor creates these
screenshots and how to interpret them please refer to
AND8307/D.
www.onsemi.com
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ESD7205 전자부품, 판매, 대치품
ESD7205, SZESD7205
PACKAGE DIMENSIONS
SOT−723
CASE 631AA
ISSUE D
−X−
D
b1
3
−Y−
E
2X e
12
TOP VIEW
2X b
0.08 X Y
3X L
1
A
HE
C
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.45 0.50 0.55
b 0.15 0.21 0.27
b1 0.25 0.31 0.37
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e 0.40 BSC
H E 1.15 1.20 1.25
L 0.29 REF
L2 0.15 0.20 0.25
3X L2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X 0.27
2X
0.40
PACKAGE
OUTLINE
1.50
3X 0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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ESD7205

ESD Protection Diodes

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