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부품번호 | NCS37005 기능 |
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기능 | Ground Fault Interrupter | ||
제조업체 | ON Semiconductor | ||
로고 | |||
전체 8 페이지수
NCS37005
Product Preview
Ground Fault Interrupter
(GFI)
Description
The NCS37005 is a signal processor for GFI applications. The
device integrates a flexible power supply (including both shunt and
LDO regulators), and differential fault detection circuits. The
proprietary fault processing circuitry offers high performance with
low turns ratio ferrite current transformers. The device also includes a
specialized DSP controller that offers best in class immunity to
nuisance loads without the need for external analog filters.
Features
• 6.0 – 18 Volt Operation (120 − 480 V AC Mains with the Appropriate
Series Impedance)
• −40 to 85°C
• Very Low Power Consumption: <5 mW @ 5 V
• 16 Pin QFN Package
• Low Cost/Turns Ratio Ferrite Current Transformer (CT) Detection of
Differential
• Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to
Guarantee Full Resolution on 50 and 60 Hz Distribution Systems
• Optimized Solenoid Deployment (coil is not energized near the AC
mains zero crossings)
• Randomized Testing Sequence to Minimize Noise and Potential
Interactions on the AC Mains
• >5 mA SCR Driver for Additional Immunity to Supply
Noise/Interference
• Superior Immunity to Nuisance Loads/Noise (up to 10 A) without
Loss of Detection Capability or CT Saturation
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• Load Panel GFI/RCD Breakers
• GFI Receptacles
• In−line GFI Circuits (power cords)
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
http://onsemi.com
1
QFN 16
MN SUFFIX
CASE 485G
16
TSSOP 16
DA SUFFIX
CASE 948F
1
MARKING DIAGRAM
XXXXX
ALYWG
CCCCC
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G or G = Pb−Free Package
CCCCC = Country of Origin
PIN CONNECTIONS
MLD
CTresGN
CTbias
CTstim
1
GND
(Top View)
ORDERING INFORMATION
Device
Package
Shipping†
NCS37005MNTWG
NCS37005MNG
NCS37005DARG
NCS37005DAG
QFN16
QFN16
TSSOP20
TSSOP20
Tape & Reel
Tube
Tape & Reel
Tube
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
April, 2012 − Rev. P0
1
Publication Order Number:
NCS37005/D
NCS37005
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Voltage Range
Vs
6.0 to 19 V
V
Input Voltage Range (Note 1)
Output Voltage Range
Vin
−0.3 to 6.0
V
Vout −0.3 to 6.0 V or (Vin + 0.3), V
whichever is lower
Maximum Junction Temperature
Storage Temperature Range
TJ(max)
TSTG
140
−65 to 150
°C
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Lead Temperature Soldering
TSLD 260 °C
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 4. THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, QFN16, 3x3.3 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead2 (Note 5)
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Symbol
RRψθJJAL
RθJA
Value
64
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Unit
°C/W
°C/W
Table 5. OPERATING RANGES (Note 6)
Parameter
Conditions
Min Typ Max Units
Operating Temperature
−40 85 C
IDD 2 mA
SCR Trigger Current
8 mA
SCR Trigger output voltage
With 5 V supply
4.5 5 V
Fault Current Sensitivity
Ground Fault with ±1% resistor for RctresD
4.5
5
5.5 mA
Ground Fault Response Time
5−20 mA
150 ms
Ground Fault Response Time
20−100 mA
75 ms
Ground Fault Response Time
>100 mA
25 ms
CT Turns Ratio
100 300
Internal Oscillator Frequency
2 MHz
CT Driver Closed Loop BW
500 KHz
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
http://onsemi.com
4
4페이지 NCS37005
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
0.15 (0.006) T U S
2X L/2 16
L
PIN 1
IDENT.
1
0.15 (0.006) T U S
0.10 (0.004)
−T− SEATING
PLANE
D
C
16X K REF
0.10 (0.004) M T U S V S
9 J1
B
−U− J
N
8
K
ÇÇÉÉÇÇÉÉK1 ÇÇÉÉ
SECTION N−N
0.25 (0.010)
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
A
−V−
G
N
F
DETAIL E
H DETAIL E
−W−
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT
7.06
1
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
http://onsemi.com
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DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |